BAP50-03 Datasheet, PDF (1/3 Pages) NXP Semiconductors – General purpose PIN diode

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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BAP50-03
Features
• Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Low diode capacitance
• Low diode forward resistance
• MARKING: A81
Maximum Ratings @ 25°C Unless Otherwise Specified
Parameter
Continuous Reverse Voltage
Forward Current
Power Dissipation(T_A=90^oC)
Junction and Storage temperature
Thermal Resistance Junction to
Ambient
Symbol
V_R
I_F
P_D
T _j，P_stg
RthJA
Limits
50
50
200
-65~+150
85
Unit
V
mA
mW
℃
K/W
General
Purpose Pin Diodes
200mW
SOD-323
A
B
C
E
H
D
Electrical Characteristics @ 25°C Unless Otherwise Specified
Parameter
Symbol Min. Max. Unit
Continuous reverse VR
50
V
voltage
Forward voltage
V_F
1.1
V
Conditions
I_R=10µA
I_F=50mA
Reverse current
I_R
100
nA
V_R=50V
Diode capacitance ^Cd1
C_d2
C_d3
r_D
Diode forward resistance _rD
r_D
1.11
0.55
0.35
40
25
5
pF V_R=0V,f=1MHz
pF V_R=1V,f=1MHz
pF V_R=5V,f=1MHz
Ω I_F=0.5mA, f=100MHz
Ω I_F=1mA , f=100MHz
Ω I_F=10mA , f=100MHz
G
J
DIMENSIONS
DIM
INCHES
MM
NOTE
MIN MAX MIN MAX
A .090 .107 2.30 2.70
B .063 .071 1.60 1.80
C .045 .053 1.15 1.35
D .031 .045 0.80 1.15
E .010 .016 0.25 0.40
G .004 .018 0.10 0.45
H .004 .010 0.10 0.25
J ----- .006 ----- 0.15
SUGGESTED SOLDER
PAD LAYOUT
0.074"
0.027”
0.022”
Revision: A
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2011/01/01