3SMAJ5956B-TP Datasheet, PDF (1/4 Pages) Micro Commercial Components – 3.0 Watt Surface Mount Silicon Zener Diodes

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
Features
• 3.3thru 200 Volt Voltage Range
• Low Inductance, Low Profile Mounting
• Glasss Passivated Junction
• High specified maximum current(IZM)when adequately heat sinking
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Halogen free available upon request by adding suffix "-HF"
• Surface Mount Application
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
0
Maximum temperature for soldering: 260 C for 10 seconds.
3SMAJ5913B
THRU
3SMAJ5956B
3.0 Watt
Surface Mount
Silicon
Zener Diodes


DO-214AC
(SMA) (LEAD F
RAME)


H




J
Maximum Ratings @ 25^oC Unless Otherwise Specified
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
Junction to Lead
Thermal
Resistance
Junction to Ambient
V_F
P_d
T_J, T_STG
R_thJL
R _thJA
1.5V
3.0W
-55^oC to
+150^oC
25к/W
135к/W
(Note: 2)
(Note: 3)
Note: 1.
2.
3.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
Forward Current @ 200mA.
Mounted on 5.0mm2 (1oz thick) Iand areas.
Lead temperature at TL=75^o_C
Lead temperature at T_A=15^O_C
A
C
E
F
G
D
B
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
A
.079
.096
2.00
2.44
B
.050
.064
1.27
1.63
C
.002
.008
.05
.20
D
---
.02
---
.51
E
.030
.060
.76
1.52
F
.065
.091
1.65
2.32
G
.189
.220
4.80
5.59
H
.157
.181
4.00
4.60
J
.090
.115
2.25
2.92
SUGGESTED SOLDER
PAD LAYOUT
0.090"
NOTE
0.085"
0.070"
Revision: D
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1 of 4
2013/04/11