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1SS404_13 Datasheet, PDF (1/2 Pages) Micro Commercial Components – High Speed Switching Diode
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
1SS404
Features
• Halogen free available upon request by adding suffix "-HF"
• High speed switching diode
• Surface Mount
• Fast Reverse Recovery Time: IR=50uA(max.)
• Small Total Capacitance: CT=46pF(typ.)
• Lead Free Finish/RoHS Compliant ("P" Suffix
designates RoHS Compliant. See ordering information)
Mechanical Data
• Marking: S51
• Polarity: Indicated by Cathode Band
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
Maximum Ratings @ 25°C Unless Otherwise Specified
Maximum (peak) Reverse
Voltage
VRM
25
V
Reverse Voltage
VR
20
V
Maximum (peak) Forward
Current
IFM
700
mA
Average Forward Current
Power Dissipation
Junction Temperature
Storage Temp. Range
IO
PD(1)
Tj
TSTG
300
mA
200
mW
150
°C
-55 to +150 °C
Electrical Characteristics @ 25°C Unless Otherwise Specified
0.16V IFM = 1.0mA;
Typical Forward Voltage
VF
0.22V IFM = 10mA;
0.38V IFM = 300mA;
Maximum Reverse
Current
IR
50uA
VR=20Volts
TJ = 25°C
Typical Junction
Capacitance
CT
46pF
Measured at
1.0MHz, VR=0V
Notes: 1. When mounted on a glass epoxy board PCB: 20mm x 20mm, with copper
pad 4mm x 4mm.
High Speed
Switching Diode
SOD-323
A
B
C
E
H
D
G
J
DIMENSIONS
DIM
INCHES
MM
NOTE
MIN MAX MIN MAX
A .090 .107 2.30 2.70
B .063 .071 1.60 1.80
C .045 .053 1.15 1.35
D .031 .045 0.80 1.15
E .010 .016 0.25 0.40
G .004 .018 0.10 0.45
H .004 .010 0.10 0.25
J ----- .006 ----- 0.15
SUGGESTED SOLDER
PAD LAYOUT
0.074"
0.027”
0.022”
Revision: B
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2013/01/01