1SS387 Datasheet, PDF (1/3 Pages) Toshiba Semiconductor – DIODE (ULTRA HIGH SPEED SWITCHING APPLICATION)

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1SS387
Features
• High speed switching diode
• Surface mount package
• For general purpose switching applications
• Marking: G
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
Mechanical Data
• Case: SOD-523, Molded Plastic
• Terminals: Solderable per MIL-STD-202, Method 208
• Polarity: Indicated by Cathode Band
• Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
Maximum Ratings @ 25°C Unless Otherwise Specified
CHARACTERISTICS
Maximum Reverse Voltage
Reverse Voltage
Average Forward Current
Peak forward surge current(10ms)
Power Dissipation
Junction Temperature
Storage Temperature Range
SYMBOL
VRM
VR
IO
IFSM
PD
TJ
TSTG
RATING
85
80
100
1
150
125
-55~125
UNIT
V
V
mA
A
mW
ć
ć
85 Volts
Switching Diode
SOD-523
A
B
C
E
G
D
F
H
Electrical Characteristics @ 25°C Unless Otherwise Specified
CHARACTERISTICS SYMBOL Typ
0.62
Forward Voltage
V_F
0.75
Reverse Current
I_R
Total Capaciatnce C_T
Reverse recovery time trr
Max
1.20
0.1
0.5
3.0
4
Unit Conditions
I _F =1mA
V
I _F =10mA
I _F =100mA
uA
V_R =30V
uA
VR=80V
pF VR=0V,f=1MHZ
ns ^{VR=6V,IF=10mA}
RL=100Ω
DIMENSIONS
INCHES
MM
DIM
MIN
A
.059
B
.043
C
.030
D
.001
E
.010
F
.003
G
.020
H
.020
MAX
.067
.051
.033
.003
.014
.006
.028
.031
MIN
1.50
1.10
0.75
0.01
0.25
0.08
0.50
0.51
MAX
1.70
1.30
0.85
0.07
0.35
0.15
0.70
0.77
NOTE
Revision: A
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2011/08/26