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| 1SS357 Datasheet, PDF (1/2 Pages) Toshiba Semiconductor – DIODE (LOW VOLTAGE HIGH SPEED SWITCHING) | |||
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
!"#
$
% !"#
1SS357
Features
⢠High speed switching diode
⢠Surface mount
⢠For general purpose switching applications
⢠Marking: S31
⢠Epoxy meets UL 94 V-0 flammability rating
⢠Moisture Sensitivity Level 1
45 Volt
Switching Diode
Mechanical Data
⢠Case: SOD-323, Molded Plastic
⢠Terminals: Solderable per MIL-STD-202, Method 208
⢠Polarity: Indicated by Cathode Band
⢠Lead Free Finish/RoHS Compliant ("P" Suffix
designates RoHS Compliant. See ordering information)
Maximum Ratings @ 25°C Unless Otherwise Specified
CHARACTERISTICS
SYMBOL RATING UNIT
Maximum Reverse Voltage
VRM
45
V
Reverse Voltage
VR
40
V
Average Forward Current
IO
100
mA
Peak forward surge current
IFSM
1
A
Power Dissipation
P
200
mW
Junction Temperature
TJ
125
Ä
Storage Temperature Range
TSTG -55~125
Ä
C
H
DIM
Electrical Characteristics @ 25°C Unless Otherwise Specified
A
B
C
D
CHARACTERISTICS SYMBOL Typ Max Unit Conditions
E
0.28
,) P$
G
Forward Voltage
VF
0.36
V
,) P$
H
0.6
,) P$
J
Reverse Current
IR
5
uA
VR=40V
Total Capaciatnce CT
18
PF VR=0V,f=1MHZ
SOD-323
A
B
E
D
G
DIMENSIONS
INCHES
MM
MIN MAX MIN MAX
.090 .107 2.30 2.70
.063 .071 1.60 1.80
.045 .053 1.15 1.35
.031 .045 0.80 1.15
.010 .016 0.25 0.40
.004 .018 0.10 0.45
.004 .010 0.10 0.25
----- .006 ----- 0.15
SUGGESTED SOLDER
PAD LAYOUT
0.074"
J
NOTE
0.027â
0.022â
Revision: A
www.mccsemi.com
1 of 2
2011/01/01
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