32C408B Datasheet, PDF (1/11 Pages) Maxwell Technologies – 4 Megabit (512K x 8-Bit) SRAM

32C408B
4 Megabit (512K x 8-Bit) SRAM
A0 1
36 NC
A1
A18
A2
A17
A3
A16
A4
A15
CS
OE
I/O1
I/O8
I/O2
I/O7
Vcc
32C408B
Vss
Vss
Vcc
I/O3
I/O6
I/O4
I/O5
WE
A14
A5
A13
A6
A12
A7
A11
A8
A10
A9 18
19 NC
A13
A12
A11
A10
A9
ROW
MEMORY MATRIX
A8
DECODER
1024 ROWS x 4096 COLUMNS
A7
A6
A5
A4
DQ0
INPUT
DATA
CONTROL
COLUMN I/O
COLUMN DECODER
DQ7
A18 A17 A16 A15 A14 A3 A2 A1 A0
DQ0
CS
WE
OE
DQ7
Logic Diagram
FEATURES:
• 512k x 8-bit CMOS architecture
• RAD-PAK® technology hardened against natural space radi-
ation
• Total dose hardness:
- > 100 krad (Si), depending upon space mission
• Single event effect:
- SEL_TH: > 68 MeV/mg/cm²
- SEU_TH: < 3MeV/mg/cm²
- SEU saturated cross section: 6E-9 cm²/bit
• Package:
-36 pin RAD-PAK® flat pack
• Fast propagation time:
-20, 25, 30 ns maximum access time
• Single 5V + 10% power supply
• Low power dissipation:
- Standby: 60mA (TTL); 10mA (CMOS)
- Operating: 180 mA (20 ns); 170 mA (25 ns); 160 mA (30
ns)
• TTL compatible inputs and outputs
• Fully static operation
- No clock or refresh required
• Three state outputs
DESCRIPTION:
Maxwell Technologies’ 32C408B high-speed 4 Megabit SRAM
microcircuit features a greater than 100 krad (Si) total dose
tolerance, depending upon space mission. Using RAD-PAK®
packaging technology, the 32C408B realizes higher density,
higher performance and lower power consumption, and is well
suited for high-speed system application. Its fully static design
eliminates the need for external clocks, while the CMOS cir-
cuitry reduces power consumption and provides higher reli-
ability. The 32C408B is equipped with eight common input/
output lines, chip select and output enable, allowing for
greater system flexibility and eliminating bus contention.
Maxwell Technologies' patented RAD-PAK packaging technol-
ogy incorporates radiation shielding in the microcircuit pack-
age. In a GEO orbit, RAD-PAK can provides true greater than
100 krad (Si) total radiation dose tolerance; dependent upon
space mission. The patented radiation-hardened RAD-PAK
technology incorporates radiation shielding in the microcircuit
package. It eliminates the need for box shielding while provid-
ing the required radiation shielding for a lifetime in orbit or a
space mission. This product is available with packaging and
screening up to Class S.
05.02.02 Rev 7
[phone] - Fax: [phone] - www.maxwell.com
All data sheets are subject to change without notice 1
©2002 Maxwell Technologies
All rights reserved.