MAX16814_15 Datasheet, PDF (9/25 Pages) Maxim Integrated Products – Integrated, 4-Channel, High-Brightness LED Driver with High-Voltage DC-DC Controller

MAX16814
Integrated, 4-Channel, High-Brightness LED
Driver with High-Voltage DC-DC Controller
Pin Description (continued)
PIN
TQFN/
QFND
TSSOP
12
15
NAME
OUT2
FUNCTION
LED String Cathode Connection 2. OUT2 is the open-drain output of the linear current sink that
controls the current through the LED string connected to OUT2. OUT2 sinks up to 150mA. If
unused, connect OUT2 to LEDGND.
13
16
LEDGND
LED Ground. LEDGND is the return path connection for the linear current sinks. Connect
SGND, LEDGND, and PGND at a single point.
LED String Cathode Connection 3. OUT3 is the open-drain output of the linear current sink that
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17
OUT3 controls the current through the LED string connected to OUT3. OUT3 sinks up to 150mA. If
unused, connect OUT3 to LEDGND.
LED String Cathode Connection 4. OUT4 is the open-drain output of the linear current sink that
15
18
OUT4 controls the current through the LED string connected to OUT4. OUT4 sinks up to 150mA. If
unused, connect OUT4 to LEDGND.
16
19
Current-Sense Input. CS is the current-sense input for the switching regulator. A sense resistor
CS
connected from the source of the external power MOSFET to PGND sets the switching current
limit. A resistor connected between the source of the power MOSFET and CS sets the slope
compensation ramp rate (see the Slope Compensation section).
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20
PGND
Power Ground. PGND is the switching current return path connection. Connect SGND,
LEDGND, and PGND at a single point.
18
1
NDRV
Switching n-MOSFET Gate-Driver Output. Connect NDRV to the gate of the external switching
power MOSFET.
MOSFET Gate-Driver Supply Input. Connect a resistor between VCC and DRV to power the
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2
DRV MOSFET driver with the internal 5V regulator. Bypass DRV to PGND with a minimum of 0.1μF
ceramic capacitor.
20
3
VCC
5V Regulator Output. Bypass VCC to SGND with a minimum of 1μF ceramic capacitor as close
as possible to the device.
—
—
EP
Exposed Pad. Connect EP to a large-area contiguous copper ground plane for effective power
dissipation. Do not use as the main IC ground connection. EP must be connected to SGND.
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