MAXQ7667 Datasheet, PDF (8/40 Pages) Maxim Integrated Products – 16-Bit, RISC, Microcontroller-Based, Ultrasonic Distance-Measuring System

16-Bit, RISC, Microcontroller-Based,
Ultrasonic Distance-Measuring System
ELECTRICAL CHARACTERISTICS (continued)
(V_DVDDIO = +5V, V_AVDD = +3.3V; V_DVDD = +2.5V, system clock (f_SYSCLK) = 16MHz, burst frequency (f_BURST) = bandpass frequency
(f_BPF) = 50kHz, C_REFBG = C_REF = 1µF in parallel with 0.01µF, f_ADCCLK = 2MHz (SAR data rate = 125ksps), T_A = T_MIN to T_MAX, unless
otherwise specified. Typical values are at T_A = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
SPI INTERFACE TIMING (Figures 11 and 12)
SPI Master Operating
Frequency
1/t_MCK 0.5 x f_SYSCLK
SPI Slave Operating
Frequency
1/t_SCK 0.25 x f_SYSCLK
MIN
TYP
MAX
UNITS
8
MHz
4
MHz
SCLK Output Pulse-Width
High/Low
MOSI Output Hold Time
After SCLK Sample Edge
t_MCH,
t_MCL
t_MOH
t_MCK/2
- 25
ns
t_MCK/2
ns
- 25
MOSI Output Valid to Sample
Edge
MISO Input Valid to SCLK
Sample Edge
t_MOV
t_MIS
t_MCK/2
- 25
ns
25
ns
MISO Input Hold Time After
SCLK Sample Edge
SCLK Inactive to MOSI
Inactive
t_MIH
t_MLH
0
ns
0
ns
SCLK Input Pulse-Width
High/Low
SS Active to First Shift Edge
MOSI Input Setup Time to
SCLK Sample Edge
MOSI Input Hold Time After
SCLK Sample Edge
MISO Output Valid After
SCLK Shift Edge Transition
SS Inactive Duration
SCLK Inactive to SS Rising
Edge
FLASH PROGRAMMING
Flash Erase Time
Flash Programming Time
Write/Erase Cycles
Data Retention
t_SCH,
t_SCL
t_SSE
t_SIS
t_SIH
t_SOV
t_SSH
t_SD
Mass erase
Page erase (512 bytes per page)
20µs per word
Average temperature = +85°C
4t_SYSCLK
25
t_SCK/2
25
50
t_SYSCLK +
25
t_SYSCLK +
25
200
20
657
10,000
15
ns
ns
ns
ns
ns
ns
ns
ms
ms
Cycles
Years
Note 1: Noise measured at bandpass filter output with ECHO+ and ECHO- shorted divided by the gain with f_BPF = 50kHz.
Note 2: Gain adjust resolution typically ranges between 6.25% and 12.5%.
Note 3: LIN 2.0 specifies a maximim data rate of 20kbps. Higher data rates could be possible with compatible devices and suitable
line conditions.
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