MAX16832A Datasheet, PDF (8/10 Pages) Maxim Integrated Products – 2MHz, High-Brightness LED Drivers with Integrated MOSFET and High-Side Current Sense

2MHz, High-Brightness LED Drivers with
Integrated MOSFET and High-Side Current Sense
HYSTERETIC
MODE
fSW
I_LED
AVG. LED
CURRENT
∆I
t
V_DIM
t1
t2
t
Figure 2. Current-Regulator Operation
Freewheeling-Diode Selection
For stability and best efficiency, a low forward-voltage
drop diode with fast reverse-recovery time and low
capacitance is recommended. A Schottky diode is a
good choice as long as its breakdown voltage is high
enough to withstand the maximum operating voltage.
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
losses and stable operation. Use a multilayer board
whenever possible for better noise immunity. Minimize
ground noise by connecting high-current ground
returns, the input bypass-capacitor ground lead, and
the output-filter ground lead to a single point (star
ground configuration). In normal operation, there are two
power loops. One is formed when the internal MOSFET
is on and the high current flows through IN, R_SENSE,
LED load, the inductor, the internal MOSFET, and GND.
The other loop is formed when the internal MOSFET is
off and the high current circulates through R_SENSE, LED
load, the inductor, and the freewheeling diode. Minimize
each loop area to reduce noise interaction.
Place R_SENSE as close as possible to CS and IN. For
better noise immunity, a Kelvin connection between CS
and R_SENSE is strongly recommended.
Due to the integrated power MOSFET, the SO-EP pack-
age has an exposed pad to transfer the heat from the
chip to the PCB. To make the thermal resistance
between the chip and PCB lower, the exposed pad
must be soldered to the PCB. The exposed pad is con-
nected to GND.
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