MAX1582 Datasheet, PDF (8/10 Pages) Maxim Integrated Products – High-Efficiency, 26V Step-Up Converter for White LED Main and Subdisplay Backlighting

High-Efficiency, 26V Step-Up Converter
for White LED Main and Subdisplay Backlighting
When laying out a board, minimize trace lengths
between the IC and R_SENSE, the inductor, the diode,
the input capacitor, and the output capacitor. Keep
traces short, direct, and wide. Keep noisy traces, such
as the LX node trace, away from CS. The input bypass
capacitor (C_IN) should be placed as close to the IC as
possible. For the thin QFN package, PGND and GND
should be connected directly to the exposed paddle
underneath the IC. The ground connections of C_IN and
C_OUT1 should be as close together as possible. The
traces from IN to the inductor and from the Schottky
diode to the LEDs can be longer.
Chip Information
TRANSISTOR COUNT: 2546
PROCESS: BiCMOS
Pin Configurations (continued)
TOP VIEW
(BALLS SOLDERED DOWN)
1
A V+
2
3
4
VP
CTRL COMP
B PGND
GND
C LX
MAX1582
EN1
D OUT1 OUT2
CS
EN2
UCSP
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