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MAX16805_07 Datasheet, PDF (5/19 Pages) Maxim Integrated Products – EEPROM-Programmable, High-Voltage, 350mA LED Drivers with LED Current Foldback
EEPROM-Programmable, High-Voltage, 350mA
LED Drivers with LED Current Foldback
ELECTRICAL CHARACTERISTICS (continued)
(VIN = VEN = 12V, CV5 = 0.1µF, IV5 = 0, CS- = GND, RSENSE = 0.56Ω, VDIM = 4V, DGND = GND, TFP/SCL = 5V, TFN/SDA = 0V,
SW = CFD = Open, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
EEPROM
VIN Voltage for EEPROM
Programming
20
22
24
V
EEPROM Data-Retention Time
I2C DIGITAL INPUTS (TFP/SCL, TFN/SDA) (Note 5)
Logic Input-Voltage High
VIH
Logic Input-Voltage Low
VIL
Input Capacitance
SDA Output Voltage Low
VOL
I2C INTERFACE TIMING (Figure 1)
ISINK = 3mA
Serial Clock Frequency
fSCL
Bus Free Time Between STOP
and START Condition
tBUF
10
Years
2.8
V
0.8
V
5
pF
0.4
V
400
kHz
1.3
µs
START Condition Hold Time
Clock Low Period
Clock High Period
Repeat START Condition Setup
Time
Data Hold Time
tHD:STA
0.6
tLOW
1.3
tHIGH
0.6
tSU:STA
0.6
A master device must provide a hold time
of at least 300ns for the SDA signal
tHD:DAT (referred to VIL of the SCL signal) in order
0
to bridge the undefined region of SCL’s
falling edge
µs
µs
µs
µs
0.9
µs
Data Setup Time
Receive SCL/SDA Rise Time
Receive SCL/SDA Fall Time
STOP Condition Setup Time
Pulse Width of Spike Suppressed
Transmit SDA Fall Time
tSU:DAT
tR
tF
tSU:STO
tSP
ISINK < 6mA, CB ≤ 400pF (Note 6)
100
ns
300
ns
250
ns
0.6
µs
50
ns
250
ns
Note 1: All devices 100% production tested at TJ = +25°C. Limits over the operating temperature range are guaranteed by design.
Note 2: Resistors were added from OUT to CS+ to aid with the power dissipation during testing.
Note 3: Dropout is measured as follows: Connect a resistor from OUT to CS+. Connect RSENSE = 0.56Ω from CS+ to CS-. Set VIN =
VOUT +3V (record VOUT as VOUT1). Reduce VIN until VOUT = 0.97 x VOUT1 (record as VIN2 and VOUT2). ΔVDO = VIN2 - VOUT2.
Note 4: tON time includes the delay and the rise time needed for IOUT to reach 90% of its final value. tOFF time is the time needed for
IOUT to drop below 10%. See the Typical Operating Characteristics. tON and tOFF are tested with 13Ω from OUT to CS+.
Note 5: TPF/SCL (SCL for MAX16805) and TPN/SDA (SDA for the MAX16805) are I2C interface compatible only when the
MAX16805/MAX16806 are the only parts on the bus for production programming.
Note 6: CB is the total bus capacitance.
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