MAX1507 Datasheet, PDF (5/12 Pages) Maxim Integrated Products – Linear Li+ Battery Charger with Integrated Pass FET and Thermal Regulation in 3mm x 3mm Thin DFN

Linear Li+ Battery Charger with Integrated Pass FET
and Thermal Regulation in 3mm x 3mm Thin DFN
Typical Operating Characteristics (continued)
(V_IN = 5V, V_BATT = 4.0V, TEMP = EN = CHG = unconnected, R_ISET = 2.8kΩ to GND, C_IN = 1µF, C_BATT = 1µF, C_VL = 0.47µF, T_A =
+25°C, unless otherwise noted.)
CHARGE CURRENT
vs. AMBIENT TEMPERATURE (TEMP = OPEN)
1000
900
V_BATT = 4.0V
800
700
600
500
V_BATT = 3.6V
400
300
200
100 _{RISET = 1.87kΩ}
0
-40 -15 10
35
60
85
AMBIENT TEMPERATURE (°C)
CHARGE CURRENT
vs. AMBIENT TEMPERATURE (TEMP = GND)
1000
900
V_BATT = 4.0V
800
700
600
500
V_BATT = 3.6V
400
300
200
100 ^RISET ^{= 1.87kΩ}
0
-40 -15 10
35
60
85
AMBIENT TEMPERATURE (°C)
Pin Description
PIN
NAME
FUNCTION
1
VL Internally Generated Logic Supply for Chip. Bypass VL to GND with a 0.47µF capacitor.
2
IN
Input Supply Voltage. Bypass IN to GND with a 1µF capacitor to improve line noise and transient rejection.
3
GND Ground. Connect GND and exposed pad to a large copper trace for maximum power dissipation.
Charge-Current Program and Fast-Charge Current Monitor. Output current from ISET is 0.958mA per amp of
4
ISET battery charging current. The charging current is set by connecting a resistor from ISET to GND. Fast-charge
current = 1461V / R_ISETΩ.
5
EN
Logic-Level Enable Input. Drive EN high to disable charger. Pull EN low or float for normal operation. EN has
an internal 200kΩ pulldown resistor.
Three-Level Input Pin. Connect TEMP to VL, GND, or leave floating. Sets maximum die temperature for
6
TEMP thermal regulation loop. Connection to GND = +90°C, floating = +100°C, VL = +130°C. TEMP is Hi-Z during
shutdown.
7
BATT Li+ Battery Connection. Bypass BATT to GND with a capacitor of at least 1µF per ampere of charge current.
Charging Indicator, Open-Drain Output. CHG goes low (and can turn on an LED) when charging begins.
8
CHG CHG is high impedance when the battery current drops below 10% of the fast-charging current, or when EN
is high. Connect a pullup resistor to the µP’s I/O voltage when interfacing with a µP logic input.
—
PAD
Exposed Pad. Connect exposed pad to a large copper trace for maximum power dissipation. The pad is
internally connected to GND.
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