MAX15091 Datasheet, PDF (4/15 Pages) Maxim Integrated Products – Solution with Current Report Output

MAX15091/MAX15091A
2.7V to 18V, 9A, Integrated Hot-Swap
Solution with Current Report Output
Electrical Characteristics (continued)
(V_IN = V_CC = 2.7V to 18V, T_A = T_J = -40°C to +85°C, unless otherwise noted. Typical values are at V_IN = 12V, R_CB = 25kΩ, and T_A
= +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
OUTPUTS
FAULT, PG Output Low
Voltage
V_OL
Low-impedance state,
I_FAULT = +5mA, I_PG = +5mA
0.4
V
FAULT, PG Output High
Leakage Current
CURRENT REPORT
I_OH
High-impedance state,
V_FAULT = 16V, V_PG = 16V
1
µA
ISENSE Full-Scale Current
ISENSE Gain Ratio
ISENSE Voltage Range
ISENSE Offset Error
ISENSE Gain Error
PG THRESHOLD
I_ISENSE
V_ISENSE
I_{ISENSE_OFF}
I_{ISENSE_ERROR}
ISENSE/I_OUT
V_IN = 12V
T_A = +25°C
T_A = -40°C to +85°C
T_A = +25°C
T_A = -40°C to +85°C
1.53
mA
170
µA/A
0
2.5
V
-32
+32
µA
-45
+45
-3
+3
%
-5.5
+5.5
PG Threshold
V_PG
Measured at V_OUT, V_IN = 12V
0.9 x
V_IN
V
PG Assertion Delay
t_PG
From V_OUT > V_PG and
(V_GATE - V_IN) > 3V
12
16
20
ms
OUT to IN Short-Circuit
Detection Threshold
V_IOSHT
Measured at V_OUT, V_IN = 12V
0.9 x
V_IN
V
OUT Precharge Threshold
THERMAL SHUTDOWN
V_PC
Measured at V_OUT, V_IN = 12V
0.5 x
V_IN
V
Thermal Shutdown
T_SD
T_J rising
+150
°C
Thermal-Shutdown Hysteresis
T_J falling
20
°C
Note 2: All devices are 100% production tested at T_A = +25°C. Limits over temperature are guaranteed by design.
Note 3: 25kΩ is the maximum allowed external resistance value to be connected at CB pin to GND for safe operation. All devices
are tested with 8.33kΩ, the parameter specified at R_CB = 25kΩ is guaranteed by bench characterization and correlation,
with respect to the tested parameter at R_CB = 8.33kΩ. The formula that describes the relationship between R_CB and the
circuit-breaker current threshold is: I_CB = R_CB/2777.8.
Note 4: The current-limit slow-comparator response time is weighed against the amount of overcurrent so the higher the
overcurrent condition, the faster the response time.
Note 5: Foldback is active during the startup phase so the internal power MOSFET operates within SOA.
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