MAX97001 Datasheet, PDF (35/36 Pages) Maxim Integrated Products – Audio Subsystem with Mono Class D Speaker and Class H Headphone Amplifiers

Audio Subsystem with Mono Class D Speaker
and Class H Headphone Amplifiers
Bypass PVDD to GND with as little trace length as pos-
sible. Connect OUTP and OUTN to the speaker using
the shortest and widest traces possible. Reducing trace
length minimizes radiated EMI. Route OUTP/OUTN as
a differential pair on the PCB to minimize the loop area
thereby reducing the inductance of the circuit. If filter
components are used on the speaker outputs, be sure
to locate them as close as possible to the MAX97001
to ensure maximum effectiveness. Minimize the trace
length from any ground tied passive components to
GND to further minimize radiated EMI.
An evaluation kit (EV kit) is available to provide an
example layout for the MAX97001. The EV kit allows
quick setup of the MAX97001 and includes easy-to-use
software, allowing all internal registers to be controlled.
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and the recommended reflow temper-
ature profile, as well as the latest information on reliability
testing results, refer to the Application Note 1891: Wafer-
Level Packaging (WLP) and Its Applications on Maxim’s
website at www.maxim-ic.com/ucsp. See Figure 15 for
the recommended PCB footprint for the MAX97001.
0.25mm
0.22mm
Figure 15. Recommended PCB Footprint
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