MAX1644EAE Datasheet, PDF (3/8 Pages) Maxim Integrated Products – PLASTIC ENCAPSULATED DEVICES

II. Manufacturing Information
A. Description: 2A, Low-Voltage, Step-Down Regulator w/ Synchronous Rectification & Internal Switches
B. Process:
S12 (Standard 1.2 micron silicon gate CMOS)
C. Number of Device Transistors:
1840
D. Fabrication Location:
Oregon or California, USA
E. Assembly Location:
Philippines
F. Date of Initial Production:
June, 1999
III. Packaging Information
A. Package Type:
16-Lead SSOP
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
Silver-filled Epoxy
E. Bondwire:
Gold (2.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
Buildsheet # 05-1101-0105
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
121 x 132 mils
Si₃N₄/SiO₂ (Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
1.2 microns (as drawn)
1.2 microns (as drawn)
5 mil. Sq.
SiO₂
Wafer Saw