MAX1555EZK Datasheet, PDF(3/8 Page) Maxim Integrated Products

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MAX1555EZK Datasheet, PDF (3/8 Pages) Maxim Integrated Products – PLASTIC ENCAPSULATED DEVICES

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II. Manufacturing Information

A. Description/Function:

B. Process:

C. Number of Device Transistors:

D. Fabrication Location:

E. Assembly Location:

F. Date of Initial Production:

SOT23 Dual-Input USB/AC Adapter 1-Cell Li+ Battery Charger

B8 - Standard 8 micron silicon gate CMOS

541

California, USA

Philippines

June, 2003

III. Packaging Information

A. Package Type:

5-Lead SOT23

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-filled Epoxy

E. Bondwire:

Gold (1.0 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

Buildsheet # 05-9000-0523

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-A112: Level 1

IV. Die Information

A. Dimensions:

B. Passivation:

C. Interconnect:

D. Backside Metallization:

E. Minimum Metal Width:

F. Minimum Metal Spacing:

G. Bondpad Dimensions:

H. Isolation Dielectric:

I. Die Separation Method:

59 X 40 mils

Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

TiW/ AlCu/ TiWN

None

.8 microns (as drawn)

5 mil. Sq.

SiO2

Wafer Saw

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