MAX1546ETL Datasheet, PDF (3/8 Pages) Maxim Integrated Products – PLASTIC ENCAPSULATED DEVICES

II. Manufacturing Information
A. Description/Function:
Dual-Phase, Quick-PWM Controller for IMVP CPU Core Power Supplies
B. Process:
S12 (Standard 1.2 micron silicon gate CMOS)
C. Number of Device Transistors:
11,015
D. Fabrication Location:
California or Oregon, USA
E. Assembly Location:
Thailand and USA
F. Date of Initial Production:
January, 2003
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112:
40-Pin QFN (6x6)
Copper
Solder Plate
Silver-filled Epoxy
Gold (1.3 mil dia.)
Epoxy with silica filler
# 05-9000-0383
Class UL94-V0
Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
130 x 172 mils
Si₃N₄/SiO₂ (Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
1.2 microns (as drawn)
1.2 microns (as drawn)
5 mil. Sq.
SiO₂
Wafer Saw