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MAX14514 Datasheet, PDF (3/14 Pages) Maxim Integrated Products – Dual Electroluminescent Lamp Driver
Dual Electroluminescent Lamp Driver
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
VDD ........................................................................-0.3V to +6.0V
CS, LX...................................................................-0.3V to +160V
V1, V2, COM................................................-0.3V to (VCS + 0.3V)
SW, EL, DIM_, SLEW, CAP, EN ..................-0.3V to (VDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
14-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951mW
Junction-to-Case Thermal Resistance (θJC) (Note 1)
14-Pin TDFN ...................................................................8°C/W
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
14-Pin TDFN .................................................................41°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +5.5V, CLAMP_TOTAL = 10nF, CCS = 3.3nF, LX = 220µH (ISAT = 170mA, RS = 5.5Ω), TA = -40°C to +85°C, unless oth-
erwise noted. Typical values are at VDD = +3.0V, TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
Input Supply Voltage
VDD
2.7
Input Supply Current
IIN
RSLEW = 375kΩ, FEL = 200Hz,
(V1,V2) - VCOM = 300VP-P
Shutdown Supply Current
ISHDN EN = GND
TA = +25°C
TA = -40°C to +85°C
Shutdown Inductor Supply
Current
ILX_SHDN EN = GND, LX = VDD, CS = VDD
Undervoltage Lockout
Undervoltage Lockout Hysteresis
EL OUTPUTS (V1, V2, COM)
VUV
VDD falling
VUV_HYST
Peak-to-Peak Output Voltage
V_ - VCOM VDD = +3V
1.8
VDIM_ = +0.5V
105
VDIM_ = +1V
210
VDIM_ = +1.3V
250
V1, V2 High-Side Switch On-
Resistance
RONHS_VN ISOURCE = 1mA
TYP MAX UNITS
5.5
V
700
µA
40
150
nA
400
1.5
µA
2.1
2.3
V
125
mV
130 162
260
310
V
300 350
1.5
3.0
kΩ
V1, V2 Low-Side Switch On-
Resistance
RONLS_VN ISINK = 1mA
0.7
2.0
kΩ
COM High-Side Switch On-
Resistance
RONHS_COM ISOURCE = 1mA
0.7
1.5
kΩ
COM Low-Side Switch On-
Resistance
High-Side Switch Off-Leakage
Low-Side Switch Off-Leakage
EL Lamp Switching Frequency
ESD Protection (COM, V1, V2
Only)
RONLS_COM ISINK = 1mA
RONHS_LEAK V1, V2, VCOM = 0, VCS = 150V
RONLS_LEAK V1, V2, VCOM = 150V, VCS = 150V
fEL
CEL = 872pF, RSLEW = 375kΩ
Human Body Model
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
0.4
1.0
kΩ
-1
+1
µA
-1
+1
µA
210
250
290
Hz
±15
±4
kV
±4
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