DS12R885_10 Datasheet, PDF (21/23 Pages) Maxim Integrated Products – RTCs with Constant-Voltage Trickle Charger

RTCs with Constant-Voltage Trickle Charger
Handling, PC Board Layout,
and Assembly
The EDIP and BGA packages contain a quartz tuning-
fork crystal. Pick-and-place equipment can be used,
but precautions should be taken to ensure that exces-
sive shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
The BGA package can be reflowed as long as the fol-
lowing conditions are met:
1. Preheating (below 160°C) is within 90 seconds.
2. Maximum time above 150°C is less than 180 seconds.
3. Maximum time above 170°C is less than 100 seconds.
4. Maximum time above 200°C is less than 60 seconds.
5. Maximum time above 220°C is less than 30 seconds.
6. Peak temperature is less than or equal to 230°C.
Exposure to reflow is limited to two times maximum.
Moisture-sensitive packages are shipped from the
factory dry-packed. Handling instructions listed on the
package label must be followed to prevent damage dur-
ing reflow. Refer to the IPC/JEDEC J-STD-020B standard
for Moisture-Sensitive Device (MSD) classifications.
The EDIP (DS12CR887) module can be successfully
processed through conventional wave-soldering tech-
niques so long as temperature exposure to the lithium
energy source does not exceed +85°C. Post-solder
cleaning with water-washing techniques is acceptable,
provided that ultrasonic vibration is not used. Such
cleaning can damage the crystal.
TOP VIEW
MOT 1
X1 2
X2 3
AD0 4
AD1 5
AD2 6
AD3 7
AD4 8
AD5 9
AD6 10
AD7 11
GND 12
DS12R885
24 V_CC
23 SQW
22 N.C.
21 RCLR
20 V_BACKUP
19 IRQ
18 RESET
17 DS
16 GND
15 R/W
14 AS
13 CS
SO (0.300")
Pin Configurations
MOT 1
N.C. 2
N.C. 3
AD0 4
AD1 5
AD2 6
AD3 7
AD4 8
AD5 9
AD6 10
AD7 11
GND 12
DS12CR887
24 V_CC
23 SQW
22 N.C.
21 N.C.
20 N.C.
19 IRQ
18 RESET
17 DS
16 N.C.
15 R/W
14 AS
13 CS
EDIP (0.700")
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