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MAX4885E Datasheet, PDF (2/10 Pages) Maxim Integrated Products – Ultra-Low Capacitance 1:2 VGA Switch with ±15kV ESD
Ultra-Low Capacitance 1:2 VGA
Switch with ±15kV ESD
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VCC, VL .....................................................................-0.3V to +6V
R_, G_, B_, SDA1, SCL1, SDA2, SCL2,
H1, V1, (Note 1) ........................................-0.3V to VCC + 0.3V
H0, V0, SDA0, SCL0, EN, SEL.........................-0.3V to VL + 0.3V
Continuous Current through RGB Switches .....................±30mA
Continuous Current through DDC Switches .....................±30mA
Peak Current through RGB Switches
(pulsed at 1ms, 10% duty cycle)...................................±90mA
Peak Current through DDC Switches (pulsed at 1ms,
10% duty cycle)............................................................±90mA
Continuous Power Dissipation (TA = +70°C)
24-Pin TQFN (derate 27.8mW/°C above +70°C) ........2222mW
Junction to Ambient Thermal Resistance (θJA) (Note 2)
24-Pin TQFN..................................................................36°C/W
Junction to Ambient Thermal Resistance (θJC) (Note 2)
24-Pin TQFN....................................................................3°C/W
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Signals exceeding VCC or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specifications. For detailed information
on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +5.0V ±10%, VL = +2V to +5.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5.0V, VL = +3.3V and
TA = +25°C.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
VCC Quiescent Supply Current
ICC
VCC = +5.0V
EN = VL
EN = GND
1
µA
VL Quiescent Supply Current
RGB ANALOG SWITCHES
IVL
VL = +3.3V
EN = VL
EN = GND
1
µA
On-Resistance
RON
VCC = +5.0V, IIN = -10mA, VIN = +0.7V
(Note 4)
6
Ω
On-Resistance Matching
On-Resistance Flatness
Off-Leakage Current
ΔRON
RFLAT(ON)
IL(OFF)
0 ≤ VIN ≤ 0.7V, IIN = -10mA
0 ≤ VIN ≤ 0.7V, IIN = -10mA
VCC = +5.5V, VIN = +0.3V or +5.5V,
VEN = 0 or VL
0.5
Ω
0.5
Ω
-1
+1
µA
On-Leakage Current
HV BUFFER
IL(ON)
VCC = +5.5V, VIN = +0.3V or +5.5V,
VEN = VL
-1
+1
µA
Input Voltage Low
VILHV
0.33 x
V
VL
Input Voltage High
Input Logic Hysteresis
Input Leakage Current
High-Output Drive Current
Low-Output Drive Current
VIHHV
VHYST
IINHV
IOHHV
IOLHV
VCC = +5.5V, VL = +5.5V, VIN = 0 or VL
VOHHV ≥ 3.0V
VOLHV ≤ 0.6V
0.66 x
V
VL
75
mV
-1
+1
µA
8.0
mA
8.0
mA
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