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| MAX4800A Datasheet, PDF (2/15 Pages) Maxim Integrated Products – Low-Charge-Injection, 8-Channel, High-Voltage Analog Switches with 20MHz Serial Interface | |||
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Low-Charge-Injection, 8-Channel, High-Voltage
Analog Switches with 20MHz Serial Interface
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VDD Logic Supply Voltage........................................-0.3V to +7V
VPP - VNN Supply Voltage ....................................................220V
VPP Positive Supply Voltage......................-0.3V to (VNN + 220V)
VNN Negative Supply Voltage ..............................+0.3V to -220V
Logic Inputs LE, CLR, CLK, DIN ..............................-0.3V to +7V
DOUT..........................................................-0.3V to (VDD + 0.3V)
RGND (MAX4802A)...............................................-4.5V to +0.3V
COM_, NO_.................................................................VNN to VPP
Continuous Power Dissipation (TA = +70°C)
26-Bump CSBGA (derate 11.8mW/°C above +70°C)..941mW
28-Pin PLCC (derate 10.5mW/°C above +70°C) .........842mW
48-Pin LQFP (derate 22.7mW/°C above +70°C)........1818mW
Operating Temperature Range...............................0°C to +70°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (excluding CSBGA, soldering, 10s) ..+300°C
Soldering Temperature (reflow)
28 PLCC.......................................................................+245°C
All other packages .......................................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
26 CSBGA
Junction-to-Ambient Thermal Resistance (θJA)...........85°C/W
Junction-to-Case Thermal Resistance (θJC)................23°C/W
28 PLCC
Junction-to-Ambient Thermal Resistance (θJA)...........44°C/W
Junction-to-Case Thermal Resistance (θJC)................10°C/W
48 LQFP
Junction-to-Ambient Thermal Resistance (θJA)...........44°C/W
Junction-to-Case Thermal Resistance (θJC)................10°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +6V, VPP = +40V to (VNN + 200V), VNN = -40V to -160V, TA = TMIN to TMAX, unless otherwise noted. Typical values
are at TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
ANALOG SWITCH
Analog-Signal Range
VCOM_,
VNO_
(Note 3)
VNN +
10
VPP -
10
V
Small-Signal Switch
On-Resistance
RONS
VPP = +40V,
VNN = -160V,
VCOM_ = 0V
ICOM = 5mA
ICOM =
200mA
VPP = +100V,
VNN = -100V,
VCOM_ = 0V
ICOM = 5mA
ICOM =
200mA
TA = 0°C
TA = +25°C
TA = +70°C
TA = 0°C
TA = +25°C
TA = +70°C
TA = 0°C
TA = +25°C
TA = +70°C
TA = 0°C
TA = +25°C
TA = +70°C
30
26
38
48
25
22
27
32
25
22
27
30
18
18
24
27
2 _______________________________________________________________________________________
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