MAX16963 Datasheet, PDF (2/13 Pages) Maxim Integrated Products – DC-DC Converter

MAX16963
Dual 2.2MHz, Low-Voltage Step-Down
DC-DC Converter
ABSOLUTE MAXIMUM RATINGS
PV, PV1, PV2 to GND...............................................-0.3V to +6V
EN1, EN2, PG1, PG2 to GND..................................-0.3V to +6V
LX_ Current............................................................ ±1.6 (Note 1)
PGND1 and PGND2 to GND ...............................-0.3V to +0.3V
PV to PV1 and PV2................................................-0.3V to +0.3V
LX1 and LX2 Continuous RMS Current....................................1A
All Other Pins Voltages to GND... (V_PV + 0.3V) to (V_GND - 0.3V)
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (T_A = +70NC)
TQFN (derate 25mW/NC above +70NC)................... 2000mW*
TSSOP (derate 26.1mW/NC above +70NC)........... 2088.8mW*
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
*As per JEDEC51 Standard (multilayer board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note 1: LX_ has internal clamp diodes for PGND_ and PV_. Applications that forward bias these diodes should take care not to
exceed the IC’s package power-dissipation limits.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (B_JA)...........40NC/W
Junction-to-Case Thermal Resistance (B_JC)..................6NC/W
TSSOP
Junction-to-Ambient Thermal Resistance (B_JA)........38.3NC/W
Junction-to-Case Thermal Resistance (B_JC)..................3NC/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_PV = V_PV1 = V_PV2 = 5V, V_{EN_} = 5V, T_A = T_J = -40°C to +125°C, unless otherwise noted. Typical values are at T_A = +25°C.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Supply Voltage Range
Supply Current
Shutdown Supply Current
Undervoltage Lockout Threshold
Low
V_PV
I_PV
I_SHDN
Normal operation
No load, V_PWM = 0V
V_EN1 = V_EN2 = 0V, T_A = +25^°C
V_{UVLO_L}
2.7
5.5
V
16
36
60
FA
1
5
FA
2.37
V
Undervoltage Lockout Threshold
High
V_{UVLO_H}
2.6
V
Undervoltage Lockout Hysteresis
0.07
V
SYNCHRONOUS STEP-DOWN DC-DC CONVERTER 1
FB Regulation Voltage
Feedback Set-Point Accuracy
pMOS On-Resistance
nMOS On-Resistance
Maximum pMOS Current-Limit
Threshold
V_OUTS1
V_OUTS1
R_{DSON_P1}
R_{DSON_N1}
I_LOAD = 4% to 100%
I_LOAD = 0%
V_PV1 = 5V, I_LX1 = 0.4A
V_PV1 = 5V, I_LX1 = 0.8A
I_LIMP1
Maxim Integrated
800
-3
0
+3
-0.5
+2
+3
90
148
68
128
1.95 2.35 3.15
mV
%
%
mI
mI
A
  2