MAX16922_12 Datasheet, PDF (2/17 Pages) Maxim Integrated Products – 2.2MHz, Dual, Step-Down DC-DC Converters, Dual LDOs, and RESET

2.2MHz, Dual, Step-Down DC-DC
Converters, Dual LDOs, and RESET
ABSOLUTE MAXIMUM RATINGS
PV1, EN to GND .....................................................-0.3V to +45V
LX1 to GND.................................................-0.5V to (PV1 + 0.3V)
LX2 to GND.................................................-0.5V to (PV2 + 0.3V)
BST to LX1.............................................................-0.3V to +6.0V
PV2, PV3, PV4, OUTS1, PWM, RESET to GND_....-0.3V to +6.0V
OUTS2 .......................................................-0.3V to (PV2 + 0.3V)
OUT3 .........................................................-0.3V to (PV3 + 0.3V)
OUT4 .........................................................-0.3V to (PV4 + 0.3V)
LX1 RMS Current .................................................................2.0A
LX2 RMS Current .................................................................1.2A
PGND2 to GND_....................................................-0.3V to +0.3V
LSUP to GND............................................................-0.3V to +6V
OUTS_, OUT_ Output Short-Circuit Duration .............Continuous
Continuous Power Dissipation (T_A = +70°C)
TQFN (derate 31.3 mW/°C above +70°C) ........................ 2500mW
TSSOP (derate 26.5 mW/°C above +70°C) ...................... 2122mW
ESD_HB (all pins) ...................................................................±2kV
ESD_MM (all pins) ................................................................±200V
ESD_CDM (corner pins) .......................................................±750V
ESD_CDM (other pins)..........................................................±500V
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ_JA) ........... 32°C/W
Junction-to-Case Thermal Resistance (θ_JC) ............... 2.7°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ_JA) ........ 37.7°C/W
Junction-to-Case Thermal Resistance (θ_JC) .................. 2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_PV1 = 13.5V, V_PV2 = V_PV3 = V_OUT1, V_PV4 = V_OUT2; T_A = T_J = -40°C to +125°C, unless otherwise noted. Typical values are at
T_A = +25°C under normal conditions, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
OUT1—SYNCHRONOUS STEP-DOWN DC-DC CONVERTER
Supply-Voltage Range
V_PV1
(Note 3)
Operation < 500ms
PV1 Undervoltage Lockout
BST Refresh Load Enable
V_UVLO,R
V_UVLO,F
V_BRLE
PV1 rising
PV1 falling
PV1 falling (option enabled)
BST Refresh Load Hysteresis
LSUP Regulator Voltage
Supply Current
V_LSUP
I_PV1
6V
V_PV1
28V
EN = low
PWM Switching Frequency
f_SW
Internally generated
Voltage Accuracy
V_OUT1
Duty cycle = 20% to 90%;
I_LOAD = 300mA to 1.2A
SKIP mode (Note 4)
DMOS On-Resistance
V_PV1 = 4V, V_BST = 9V, I_LX1 = 0.2A
Current-Limit Threshold
Soft-Start Ramp Time
MIN TYP MAX UNITS
3.7
3.7
2.85 3.3
6.45
0.65
4.75 5.0
14
2.0
2.2
-3
-2
300
1.4 1.75
2.2
28
45
4.0
5.45
2.4
+3
+4
700
2.1
V
V
V
V
V
μA
MHz
%
m
A
ms
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