MAX16909 Datasheet, PDF (2/18 Pages) Maxim Integrated Products – 36V, 220kHz to 1MHz Step-Down Converter with Low Operating Current

MAX16909
36V, 220kHz to 1MHz Step-Down Converter
with Low Operating Current
ABSOLUTE MAXIMUM RATINGS
SUP, SUPSW, LX, EN to GND...............................-0.3V to +42V
SUP to SUPSW......................................................-0.3V to +0.3V
BST to GND...........................................................-0.3V to +47V
BST to LX ................................................................-0.3V to +6V
OUT to GND...........................................................-0.3V to +12V
FOSC, COMP, BIAS, FSYNC, I.C., PGOOD,
FB to GND............................................................-0.3V to +6V
LX Continuous RMS Current....................................................4A
Output Short-Circuit Duration....................................Continuous
Continuous Power Dissipation (T_A = +70NC)
TSSOP (derate 26.1mW/^oC above +70NC)........... 2088.8mW*
TQFN (derate 28.6mW/^oC above +70NC)............. 2285.7mW*
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow)...................................... +260^oC
*As per the JEDEC 51 standard (multilayer board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (BJA)........38.3NC/W
Junction-to-Case Thermal Resistance (BJC)..................3NC/W
TQFN
Junction-to-Ambient Thermal Resistance (BJA)...........35NC/W
Junction-to-Case Thermal Resistance(BJC)................2.7NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_SUP = V_SUPSW = 14V, V_EN = 14V, R_FOSC = 120kI, T_A = T_J = -40NC to +125NC, unless otherwise noted. Typical values are at
T_A = +25NC.)
PARAMETER
Supply Voltage Range
Load-Dump Event Supply
Voltage
Supply Current
Shutdown Supply Current
BIAS Regulator Voltage
BIAS Undervoltage Lockout
BIAS Undervoltage-Lockout
Hysteresis
Thermal-Shutdown Threshold
Thermal-Shutdown Threshold
Hysteresis
OUTPUT VOLTAGE (OUT)
Output Voltage
SYMBOL
V_SUP,
V_SUPSW
CONDITIONS
V_{SUP_LD} t_LD < 1s
I_SUP
I_LOAD = 1.5A
Standby mode, no load, V_OUT = 5V
I_{SUP_STANDBY Standby mode, no load, VOUT = 5V,}
T_A = +25°C
I_SHDN
V_EN = 0V
V_BIAS
V_SUP = V_SUPSW = 6V to 36V
V_UVBIAS V_BIAS rising
V_OUT
V_FB = V_BIAS, normal operation
MIN TYP MAX UNITS
3.5
36
V
42
V
3.5
mA
30
60
FA
30
45
5
12
FA
4.7
5
5.3
V
2.9
3.1
3.3
V
400
mV
+175
NC
15
NC
4.925 5 5.075
V
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*The parametric values (min, typ, max limits) shown in the Electrical Characteristics table supersede values quoted elsewhere in this data sheet.