MAX16839_11 Datasheet, PDF (2/11 Pages) Maxim Integrated Products – High-Voltage, Linear High-Brightness LED Driver with Open-LED Fault Detect

High-Voltage, Linear High-Brightness LED
Driver with Open-LED Fault Detect
ABSOLUTE MAXIMUM RATINGS
(Voltages are specified with respect to GND.)
IN, SINK.................................................................-0.3V to +45V
FLTS.......................................................................-0.3V to +18V
DIM...........................................................................-0.3V to +6V
CS.........................................................................-0.3V to +0.5V
Continuous Current into SINK and CS.............................120mA
Continuous Power Dissipation (T_A = +70NC)
6-Pin TDFN (derate 23.8mW/NC above +70NC)......1904.8mW
8-Pin SO (derate 18.9mW/NC above +70NC)..........1509.4mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
SO
Junction-to-Ambient Thermal Resistance (B_JA)...........42NC/W
Junction-to-Case Thermal Resistance (B_JC)...................... 9NC/W
Junction-to-Ambient Thermal Resistance (B_JA)...........53NC/W
Junction-to-Case Thermal Resistance (B_JC)..................5NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_IN = 12V, V_FLTS = 0V, R_CS = 4.07I, V_GND = 0V, DIM = unconnected, C_IN = 0.1FF (Note 2), T_J = T_A = -40NC to +125NC, unless
otherwise noted. Typical values are at T_A = +25NC.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Supply Voltage Range
VIN
5
40
V
Quiescent Current
IIN
0.25 0.6
mA
Undervoltage Lockout
VUVLO VIN rising
3.6
V
UVLO Hysteresis
0.3
V
CS REGULATOR
TA = +25NC
195.5 203 210.5
CS Voltage Accuracy
VCS _{-40NC P TA P +125NC, 0.9V P VSINK P 5.5V}
(Note 4)
193
mV
213
CS Load Regulation
Internal Switch On-Resistance
RDS_ON
LED CURRENT TRANSIENT RESPONSE
20mA P ISINK P 100mA
(Note 5)
40
FV/mA
2
4
I
LED Current Turn-On Delay
tDIN
30% of VIN rising edge to 50% of ISINK,
VDIM = 2.1V (Notes 6, 7)
4
9
Fs
LED Current Turn-On Delay
Relative to DIM
tDDIN VDIM rising edge to 50% of ISINK
2.3
5.5
Fs
LED Current Turn-Off Delay
Relative to DIM
VDIM falling edge to 50% of ISINK
1.3
3.5
Fs
LED Current Rise Time
LED Current Fall Time
tr
10% of ISINK to 90% of ISINK
tf
90% of ISINK to 10% of ISINK
2.5
5.5
Fs
2.5
6
Fs
2   _______________________________________________________________________________________