MAX16839 Datasheet, PDF (2/11 Pages) Maxim Integrated Products – High-Voltage, Linear High-Brightness LED Driver with Open-LED Fault Detect

High-Voltage, Linear High-Brightness LED
Driver with Open-LED Fault Detect
ABSOLUTE MAXIMUM RATINGS
(Voltages are specified with respect to GND.)
IN, SINK.................................................................-0.3V to +45V
FLTS.......................................................................-0.3V to +18V
DIM...........................................................................-0.3V to +6V
CS.........................................................................-0.3V to +0.5V
Continuous Current into SINK and CS.............................120mA
Continuous Power Dissipation (T_A = +70NC)
6-Pin TDFN (derate 23.8mW/NC above +70NC)......1904.8mW
Junction-to-Case Thermal Resistance (B_JC) (Note 1)....9NC/W
Junction-to-Ambient Thermal Resistance (B_JA) (Note 1).. 42NC/W
8-Pin SO (derate 18.9mW/NC above +70NC)..........1509.4mW
Junction-to-Case Thermal Resistance (BJC) (Note 1)....5NC/W
Junction-to-Ambient Thermal
Resistance (B_JA) (Note 1)............................................53NC/W
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = 12V, VFLTS = 0V, RCS = 4.07I, VGND = 0V, DIM = unconnected, CIN = 0.1FF (Note 2), TJ = TA = -40NC to +125NC, unless
otherwise noted. Typical values are at T_A = +25NC.) (Note 3)
PARAMETER
Supply Voltage Range
Quiescent Current
Undervoltage Lockout
UVLO Hysteresis
CS REGULATOR
CS Voltage Accuracy
SYMBOL
VIN
IIN
VUVLO
VIN rising
CONDITIONS
TA = +25NC
VCS _{-40NC P TA P +125NC, 0.9V P VSINK P 5.5V}
(Note 4)
CS Load Regulation
Internal Switch On-Resistance
R_{DS_ON}
LED CURRENT TRANSIENT RESPONSE
20mA P I_SINK P 100mA
(Note 5)
LED Current Turn-On Delay
tDIN
30% of VIN rising edge to 50% of ISINK,
V_DIM = 2.1V (Notes 6, 7)
LED Current Turn-On Delay
Relative to DIM
tDDIN VDIM rising edge to 50% of ISINK
LED Current Turn-Off Delay
Relative to DIM
VDIM falling edge to 50% of ISINK
LED Current Rise Time
LED Current Fall Time
FAULT EVENT STATUS MEMORY
FLTS Activation Threshold
FLTS Activation Hysteresis
LED Open Threshold
LED Open Blanking
Fault Voltage
tr
tf
VINTH
VCSO
TB
VFLTS
10% of ISINK to 90% of ISINK
90% of ISINK to 10% of ISINK
VIN rising, VCS = 0V
VIN = 40V, VCS = 0V, CFLTS = 0.1FF
MIN TYP MAX UNITS
5
40
V
0.25 0.6
mA
3.6
V
0.3
V
195.5 203 210.5
mV
193
213
40
FV/mA
2
4
I
4
9
Fs
2.3
5.5
Fs
1.3
3.5
Fs
2.5
5.5
Fs
2.5
6
Fs
7
7.38 7.75
V
20
mV
25
30
35
mV
14
25
50
Fs
12
15
18
V
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