MAX16838_11 Datasheet, PDF (2/21 Pages) Maxim Integrated Products – Integrated, 2-Channel, High-Brightness LED Driver with High-Voltage Boost and SEPIC Controller

Integrated, 2-Channel, High-Brightness LED Driver
with High-Voltage Boost and SEPIC Controller
ABSOLUTE MAXIMUM RATINGS
IN, OUT_, DRAIN to SGND....................................-0.3V to +45V
EN to SGND................................................-0.3V to (VIN + 0.3V)
PGND to SGND.....................................................-0.3V to +0.3V
LEDGND to SGND................................................-0.3V to +0.3V
DRV to PGND........... -0.3V to the lower of (VIN + 0.3V) and +6V
GATE to PGND........................................................-0.3V to +6V
NDRV to PGND........................................-0.3V to (VDRV + 0.3V)
VCC, FLT, DIM, CS, OV, CFB, to SGND..................-0.3V to +6V
RT, COMP, ISET to SGND.........................-0.3V to (VCC + 0.3V)
DRAIN and CS Continuous Current................................... Q2.5A
OUT_ Continuous Current.................................................175mA
VDRV Short-Circuit Duration ......................................Continuous
Continuous Power Dissipation (TA = +70NC)
20-Pin TQFN (derate 25.6mW/NC above +70NC).............2051mW
20-Pin TSSOP (derate 26.5mW/NC above +70NC).......2122mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
20 TQFN
20 TSSOP
Juction-to-Ambient Thermal Resistance (BJA).......... +39NC/W
Junction-to-Case Thermal Resistance (BJC)............... +6NC/W
Junction-to-Ambient Thermal Resistance (BJA)...... +37.7NC/W
Junction-to-Case Thermal Resistance (BJC)............... +2NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VIN = VEN = 12V, RRT = 12.2kI, RISET = 15kI, CVCC = 1FF, VCC = VDRV = VCFB, DRAIN, COMP, OUT_, FLT = unconnected, VOV
= VCS = VLEDGND = VDIM = VPGND = VSGND = 0V, VGATE = VNDRV, TA = TJ = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = 25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Input Voltage Range
Input Voltage Range
Quiescent Supply Current
Standby Supply Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis
VIN
VIN
IQ
ISH
UVLOIN
Internal LDO on
VIN = VCC
VDIM = 5V
VEN = SGND (Note 3)
VIN rising, VDIM = 5V
4.75
40
V
4.55
5.5
V
3.1
5
mA
15.5
40
FA
4
4.3 4.55
V
177
mV
DRV REGULATOR
Output Voltage
VDRV
5.75V < VIN < 10V, 0.1mA < ILOAD < 30mA
6.5V < VIN < 40V, 0.1mA < ILOAD < 3mA
4.75
5
5.25
V
Dropout Voltage
VDO
(VIN - VDRV)
VIN = 4.75V, IOUT = 30mA
0.11 0.5
V
Short-Circuit Current Limit
DRV shorted to GND
97
mA
VCC Undervoltage Lockout
Threshold
UVLOVCC VCC rising
3.4
4.0
4.4
V
VCC (UVLO) Hysteresis
123
mV
2   _______________________________________________________________________________________