MAX16838 Datasheet, PDF (2/21 Pages) Maxim Integrated Products – Integrated, 2-Channel, High-Brightness LED Driver with High-Voltage Boost and SEPIC Controller

Integrated, 2-Channel, High-Brightness LED Driver
with High-Voltage Boost and SEPIC Controller
ABSOLUTE MAXIMUM RATINGS
IN, OUT_, DRAIN to SGND....................................-0.3V to +45V
EN to SGND................................................-0.3V to (VIN + 0.3V)
PGND to SGND.....................................................-0.3V to +0.3V
LEDGND to SGND................................................-0.3V to +0.3V
DRV to PGND........... -0.3V to the lower of (VIN + 0.3V) and +6V
GATE to PGND........................................................-0.3V to +6V
NDRV to PGND........................................-0.3V to (VDRV + 0.3V)
VCC, FLT, DIM, CS, OV, CFB, to SGND..................-0.3V to +6V
RT, COMP, ISET to SGND.........................-0.3V to (VCC + 0.3V)
DRAIN and CS Continuous Current................................... Q2.5A
OUT_ Continuous Current.................................................175mA
VDRV Short-Circuit Duration ......................................Continuous
Continuous Power Dissipation (TA = +70NC)
20-Pin TQFN (derate 25.6mW/NC above +70NC)
(Note 1).............................................................................2051mW
Junction-to-Case Thermal Resistance (BJC)............... +6NC/W
Juction-to-Ambient Thermal Resistance (BJA)........... +39NC/W
20-Pin TSSOP (derate 26.5mW/NC above +70NC)
(Note 1).......................................................................2122mW
Junction-to-Case Thermal Resistance (BJC)............... +2NC/W
Junction-to-Ambient Thermal Resistance (BJA)...... +37.7NC/W
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Soldering Temperature (reflow).......................................+260NC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = VEN = 12V, RRT = 12.2kI, RISET = 15kI, CVCC = 1FF, VCC = VDRV = VCFB, DRAIN, COMP, OUT_, FLT = unconnected, VOV
= VCS = VLEDGND = VDIM = VPGND = VSGND = 0V, VGATE = VNDRV, TA = TJ = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = 25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Input Voltage Range
Input Voltage Range
Quiescent Supply Current
Standby Supply Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis
VIN
VIN
IQ
ISH
UVLO_IN
Internal LDO on
VIN = VCC
VDIM = 5V
VEN = SGND (Note 3)
V_IN rising, V_DIM = 5V
4.75
40
V
4.55
5.5
V
3.1
5
mA
15.5
40
FA
4
4.3 4.55
V
177
mV
DRV REGULATOR
Output Voltage
VDRV
5.75V < VIN < 10V, 0.1mA < ILOAD < 30mA _4.75
6.5V < VIN < 40V, 0.1mA < ILOAD < 3mA
5
5.25
V
Dropout Voltage
VDO
(VIN - VDRV)
VIN = 4.75V, IOUT = 30mA
0.11 0.5
V
Short-Circuit Current Limit
DRV shorted to GND
97
mA
VCC Undervoltage Lockout
Threshold
UVLOVCC VCC rising
3.4
4.0
4.4
V
VCC (UVLO) Hysteresis
RT OSCILLATOR
123
mV
Switching Frequency Range
Duty Cycle
fSW
DMAX
fSW = 200kHz
fSW = 2000kHz
200
2000 kHz
87
90
95
%
83
85
91
%
2   _______________________________________________________________________________________