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MAX16834 Datasheet, PDF (2/23 Pages) Maxim Integrated Products – High-Power LED Driver with Integrated High-Side LED Current Sense and PWM Dimming MOSFET Driver
High-Power LED Driver with Integrated High-Side LED
Current Sense and PWM Dimming MOSFET Driver
ABSOLUTE MAXIMUM RATINGS
IN, HV, LV to SGND................................................-0.3V to +30V
OVP+, SENSE+, DIMOUT, CLV to SGND ..............-0.3V to +30V
SENSE+ to LV........................................................-0.3V to +0.3V
HV, IN to LV ............................................................-0.3V to +30V
OVP+, CLV, DIMOUT to LV ......................................-0.3V to +6V
PGND to SGND .....................................................-0.3V to +0.3V
VCC to SGND..........................................................-0.3V to +12V
NDRV to PGND...........................................-0.3V to (VCC + 0.3V)
All Other Pins to SGND.............................................-0.3V to +6V
NDRV Continuous Current................................................±50mA
DIMOUT Continuous Current..............................................±2mA
VCC Short-Circuit Current to SGND Duration ...........................1s
Continuous Power Dissipation (TA = +70°C)
20-Pin TQFN (4mm x 4mm)
(derate 25.6mW/°C* above +70°C) ............................2051mW
20-Pin TSSOP-EP (derate 26.5mW/°C above +70°C) ....2122mW
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
20-Pin TQFN 4mm x 4mm .................................................39°C/W
20-Pin TSSOP..................................................................37.7°C/W
Junction-to-Case Thermal Resistance (θJC) (Note 1)
20-Pin TQFN 4mm x 4mm ...............................................6°C/W
20-Pin TSSOP..................................................................2°C/W
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
*As per JEDEC51 standard (multilayer board).
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = VHV = 12V, VUVEN = 5V, VLV = VPWMDIM = SGND, CVCC = 4.7µF, CLCV = 100nF, CREF = 100nF, RSENSE+ = 0.1Ω,
RRT = 10kΩ, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Input Voltage Range
VIN
4.75
28
V
Quiescent Supply Current
Shutdown Supply Current
IQ
ISHDN
Excluding ILED
VUVEN = 0
6
10
mA
30
60
µA
INTERNAL LINEAR REGULATOR (VCC)
Output Voltage
VCC
0 ≤ ICC ≤ 50mA, 9.5V ≤ VIN ≤ 28V
6.3
7
7.7
V
Dropout Voltage
Short-Circuit Current
VDO
ICC = 35mA (Note 2)
VCC = 0, VIN = 12V
0.65
1
V
80
300
mA
LINEAR REGULATOR (CLV)
Output Voltage
(VCLV - VLV)
0 ≤ ICLV ≤ 2mA, 6V ≤ VHV ≤ 28V,
6V ≤ V(HV-LV) ≤ 22V
4.7
5
5.3
V
Dropout Voltage
VDO
ICLV = 2mA, 0 ≤ VLV ≤ 23.3V (Note 3)
Short-Circuit Current
VCLV = 12V, VIN = 12V, VHV = 24V
2.2
REFERENCE VOLTAGE (REF)
0.5
V
10
mA
Output Voltage
VREF
0 ≤ IREF ≤ 1mA, 4.75V ≤ VIN ≤ 28V
3.625 3.70 3.775
V
REF Short-Circuit Current
VREF = 0
30
mA
UNDERVOLTAGE LOCKOUT/ENABLE INPUT (UVEN)
UVEN On Threshold Voltage
VUVEN_THUP
1.395 1.435 1.475
V
UVEN Threshold Voltage
Hysteresis
200
mV
Input Leakage Current
ILEAK
VUVEN = 0
I1I
µA
PWMDIM
PWMDIM On Threshold Voltage
VPWMDIM
1.395 1.435 1.475
V
PWMDIM Threshold Voltage
Hysteresis
200
mV
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