MAX16016_1111 Datasheet, PDF (2/21 Pages) Maxim Integrated Products – Low-Power uP Supervisory Circuits with Battery-Backup Circuit and Chip-Enable Gating

Low-Power µP Supervisory Circuits with
Battery-Backup Circuit and Chip-Enable Gating
ABSOLUTE MAXIMUM RATINGS
V_CC, BATT, OUT, BATT_TEST to GND.....................-0.3V to +6V
RESET, RESET, PFO, BATTOK, WDO, BATTON,
BATT_TEST, LL, (all open-drain) to GND .................-0.3V to +6V
RESET, RESET, BATTOK, WDO, BATTON,
LL (all push-pull) to GND......................-0.3V to (V_OUT + 0.3V)
WDI, PFI to GND.......................................-0.3V to (V_OUT + 0.3V)
CEIN, CEOUT to GND ..............................-0.3V to (V_OUT + 0.3V)
MR to GND .................................................-0.3V to (V_CC + 0.3V)
Input Current
V_CC Peak Current.................................................................1A
V_CC Continuous Current ...............................................250mA
BATT Peak Current .......................................................500mA
BATT Continuous Current ...............................................70mA
Output Current
OUT Short Circuit to GND Duration ....................................10s
RESET, RESET, BATTON ....................................................20mA
Continuous Power Dissipation (T_A = +70°C)
10-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951mW
16-Pin TQFN (derate 25mW/°C above +70°C) ..........2000mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
TDFN ............................................................................+260°C
TQFN............................................................................+240°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to Ambient Thermal Resistance (θ_JA) ...........41°C/W
Junction-to Case Thermal Resistance (θ_JC) ..................9°C/W
TQFN
Junction-to Ambient Thermal Resistance (θ_JA) ...........40°C/W
Junction-to Case Thermal Resistance (θ_JC) ..................6°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_CC = 1.53V to 5.5V, V_BATT = 3V, T_A = -40°C to +85°C, unless otherwise noted. Typical values are at T_A = +25°C.) (Note 2)
PARAMETER
Operating Voltage Range (Note 3)
Supply Current
Supply Current in
Battery-Backup Mode
SYMBOL
CONDITIONS
V_CC, V_BATT V_CC or V_BATT > V_TH
I_CC
V_CC > V_TH
V_CC = 1.62V
V_CC = 2.8V
V_CC = 3.6V
V_CC = 5.5V
I_BATT
V_CC = 0V
V_CC Switchover Threshold Voltage
V_CC rising, V_CC - V_BATT
BATT Switchover Threshold
Voltage
BATT Standby Current
BATT Freshness Leakage Current
V_CC to OUT On-Resistance
Output Voltage in
Battery-Backup Mode
R_ON
V_OUT
V_CC falling, V_CC < V_TH, V_CC - V_BATT
V_CC > V_BATT + 0.2V
V_BATT = 5.5V
V_CC = 4.75V, I_OUT = 150mA
V_CC = 3.15V, I_OUT = 65mA
V_CC = 2.35V, I_OUT = 25mA
V_CC = 1.91V, I_OUT = 10mA
V_BATT = 4.5V, I_OUT = 20mA
V_BATT = 2.5V, I_OUT = 20mA
MIN
TYP
0
1.2
1.9
2.3
3.4
0.25
0.1
x V_CC
0
-10
1.4
1.7
2.1
2.6
V_BATT - 0.1
V_BATT - 0.15
MAX
5.5
2
3
3.5
5
0.5
UNITS
V
µA
µA
V
mV
+10
nA
20
nA
4.5
4.5
Ω
5.0
5.5
V
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