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MAX15038_09 Datasheet, PDF (2/19 Pages) Maxim Integrated Products – 4A, 2MHz Step-Down Regulator with Integrated Switches
4A, 2MHz Step-Down Regulator
with Integrated Switches
ABSOLUTE MAXIMUM RATINGS
IN, PWRGD to GND..................................................-0.3V to +6V
VDD to GND ..................-0.3V to the lower of +4V or (VIN + 0.3V)
COMP, FB, MODE, REFIN, CTL1, CTL2, SS,
FREQ to GND ..........................................-0.3V to (VDD + 0.3V)
OUT, EN to GND ......................................................-0.3V to +6V
BST to LX..................................................................-0.3V to +6V
BST to GND ............................................................-0.3V to +12V
PGND to GND .......................................................-0.3V to +0.3V
LX to PGND ..................-0.3V to the lower of +6V or (VIN + 0.3V)
LX to PGND ..........-1V to the lower of +6V or (VIN + 1V) for 50ns
ILX(RMS) (Note 1) ......................................................................4A
VDD Output Short-Circuit Duration .............................Continuous
Converter Output Short-Circuit Duration ....................Continuous
Continuous Power Dissipation (TA = +70°C)
24-Pin TQFN (derate 27.8mW/°C above +70°C) ........2222mW
Thermal Resistance (Note 2)
θJA.................................................................................36°C/W
θJC ..................................................................................6°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care not to exceed
the IC’s package power dissipation limits.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = VEN = 5V, CVDD = 2.2µF, TA = TJ = -40°C to +85°C, typical values are at TA = +25°C, circuit of Figure 1, unless otherwise
noted.) (Note 3)
PARAMETER
CONDITIONS
MIN
IN
IN Voltage Range
2.9
IN Supply Current
fS = 1MHz, no load
VIN = 3.3V
VIN = 5V
Total Shutdown Current from IN
3.3V LDO (VDD)
VIN = 5V, VEN = 0V
VIN = VDD = 3.3V, VEN = 0V
VDD Undervoltage Lockout
Threshold
LX starts/stops switching
VDD rising
VDD falling
2.35
Minimum glitch-width
rejection
TYP MAX UNITS
5.5
V
4.7
8
mA
5
8.5
10
20
µA
45
2.6
2.8
V
2.55
10
µs
VDD Output Voltage
VDD Dropout
VDD Current Limit
BST
BST Supply Current
PWM COMPARATOR
VIN = 5V, IVDD = 0 to 10mA
VIN = 2.9V, IVDD = 10mA
VIN = 5V, VDD = 0V
VBST = VIN = 5V, VLX = 0 or 5V, VEN = 0V
3.1
3.3
3.5
V
0.08
V
25
40
mA
0.025
µA
PWM Comparator Propagation
Delay
10mV overdrive
20
ns
PWM Peak-to-Peak Ramp
Amplitude
1
V
PWM Valley Amplitude
0.8
V
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