MAX15024_11 Datasheet, PDF (2/16 Pages) Maxim Integrated Products – Single/Dual, 16ns, High Sink/Source Current Gate Drivers AEC-Q100 Qualified

Single/Dual, 16ns, High Sink/Source
Current Gate Drivers
ABSOLUTE MAXIMUM RATINGS
V_CC to GND ............................................................-0.3V to +30V
REG to GND ..............-0.3V to the lower of +22V or (V_CC + 0.3V)
DRV to PGND .........................................................-0.3V to +22V
IN_ ..........................................................................-0.3V to +22V
FB/SET to GND.........................................................-0.3V to +6V
P_OUT to DRV ........................................................-22V to +0.3V
N_OUT to PGND.....................................................-0.3V to +22V
OUT1, OUT2 to PGND ..............................-0.3V to (V_DRV + 0.3V)
PGND to GND .......................................................-0.3V to +0.3V
P_OUT, N_OUT Continuous Source/Sink Current* .......... 200mA
OUT1, OUT2 Continuous Source/Sink Current*................200mA
Continuous Power Dissipation (T_A = +70°C)
10-Pin TDFN, Single-Layer Board
(derate 18.5mW/°C above +70°C) ...........................1481.5mW
10-Pin TDFN, Multilayer Board
(derate 24.4mW/°C above +70°C) ...........................1951.2mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
*Continuous output current is limited by the power dissipation of the package.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
10 TDFN
Junction-to-Ambient Thermal Resistance (θ_JA)...............41°C/W
Junction-to-Case Thermal Resistance (θ_JC)......................9°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial.
MAX15024 ELECTRICAL CHARACTERISTICS
(V_CC = V_DRV = V_REG = 10V, FB/SET = GND, T_A = T_J = -40°C to +125°C, unless otherwise noted. Typical values are at T_A = T_J =
+ 25°C). (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
SYSTEM SPECIFICATIONS
Input Voltage Range
V_DRV Turn-On Voltage
Quiescent Supply Current
Quiescent Supply Current
Under UVLO Condition
V_CC powered only, V_REG = _MAX15024B
6.5
V_DRV decoupled with
V_CC
minimum 1µF to GND
MAX15024A
4.5
V_CC = V_REG = V_DRV (MAX15024B)
6.5
28.0
28.0
V
18.0
V_CC = V_REG = V_DRV (MAX15024A)
4.5
18.0
V_DRV__ON V_CC = V_REG = 10V, IN+ = V_CC, IN- = GND
1.7
2.3
V
IN_ = V_CC or GND
700 1350
µA
IN_ = V_CC or GND
250
µA
Switching Supply Current
V_CC Undervoltage Lockout
V_CC Undervoltage-Lockout
Hysteresis
Switching at 250kHz, C_L = 0F
UVLO_ V_CC V_CC rising
1.5
3.0
mA
3.0
3.4
3.8
V
300
mV
V_CC Undervoltage Lockout to
Output Delay
V_CC rising
V_CC falling
REG REGULATOR (V_CC = 12V, REG = V_DRV, C_L = 1μF, FB/SET = GND)
Output Voltage
V_REG
12V < V_CC < 28V, 0 < I_LOAD < 10mA
100
µs
2
9
10
11
V
Dropout Voltage
V_R__DO
V_CC = 6.5V, I_LOAD = 100mA
V_CC = 4.5V, I_LOAD = 50mA
0.4
0.9
V
0.2
0.5
Load Regulation
Line Regulation
V_CC = 12V, I_LOAD = 0 to 100mA
12V < V_CC < 28V
1
%
10
mV
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