MAX15023ETG-T Datasheet, PDF (2/28 Pages) Maxim Integrated Products – Wide 4.5V to 28V Input, Dual-Output Synchronous Buck Controller

MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
ABSOLUTE MAXIMUM RATINGS
IN to SGND.............................................................-0.3V to +30V
BST_ to V_CC............................................................-0.3V to +30V
LX_ to SGND .............................................................-1V to +30V
EN_ to SGND............................................................-0.3V to +6V
PGOOD_ to SGND .................................................-0.3V to +30V
BST_ to LX_ ..............................................................-0.3V to +6V
DH_ to LX_ ..........................................….-0.3V to (V_{BST_} + 0.3V)
DL_ to PGND_ ............................................-0.3V to (V_CC + 0.3V)
SGND to PGND_ .................................................. -0.3V to +0.3V
V_CC to SGND................-0.3V to the lower of +6V or (V_IN + 0.3V)
All Other Pins to SGND...............................-0.3V to (V_CC + 0.3V)
V_CC Short Circuit to SGND.........................................Continuous
V_CC Input Current (IN = V_CC, internal LDO not used) ......600mA
PGOOD_ Sink Current ........................................................20mA
Continuous Power Dissipation (T_A = +70°C)(Note 1)
24-Pin TQFN-EP (derate 27.8mW/°C above +70°C)......2222.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: These power limits are due to the thermal characteristics of the package, absolute maximum junction temperature (150°C),
and the JEDEC 51-7 defined setup. Maximum power dissipation could be lower, limited by the thermal shutdown protection
included in this IC.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
24 TQFN-EP
Junction-to-Ambient Thermal Resistance (θ_JA)...............+36°C/W
Junction-to-Case Thermal Resistance (θ_JC)......................+8°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_IN = 12V, R_T = 33kΩ, C_VCC = 4.7µF, C_IN = 1µF, T_A = -40°C to +85°C, unless otherwise noted. Typical values are at T_A = +25°C.)
(Note 3)
PARAMETER
GENERAL
SYMBOL
CONDITIONS
Input Voltage Range
Quiescent Supply Current
Standby Supply Current
V_CC REGULATOR
Output Voltage
V_CC Regulator Dropout
V_IN
I_IN
I_{IN_SBY}
V_IN = V_CC
V_FB1 = V_FB2 = 0.9V, no switching
V_EN1 = V_EN2 = V_SGND
V_CC
6V < V_IN < 28V, I_LOAD = 5mA
V_IN = 6V, 1mA < I_LOAD < 100mA
I_LOAD = 100mA
V_CC Short-Circuit Output Current
V_IN = 5V
V_CC Undervoltage Lockout
V_{CC_UVLO} V_CC falling
V_CC Undervoltage Lockout
Hysteresis
ERROR AMPLIFIER (FB_, COMP_)
FB_ Input Voltage Set-Point
FB_ Input Bias Current
V_{FB_}
I_{FB_}
V_{FB_} = 0.6V
MIN TYP MAX
5.5
28
4.5
5.5
4.5
6
0.21 0.35
UNITS
V
mA
mA
5.00
5.2
5.50
V
0.07
V
150 250
mA
3.6
3.8
4
V
430
mV
594
600
606
mV
-250
+250
nA
2
Maxim Integrated