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| MAX14870_15 Datasheet, PDF (2/15 Pages) Maxim Integrated Products – Compact 4.5V to 36V Full-Bridge DC Motor Drivers | |||
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MAX14870/MAX14872
Compact 4.5V to 36V
Full-Bridge DC Motor Drivers
Absolute Maximum Ratings
(All voltages referenced to GND.)
VDD.........................................................................-0.3V to +40V
M1, M2...................................................... -0.3V to (VDD + 0.3V)
PWM, DIR, FWD, REV, FAULT, EN, SNS ................... -0.3V to +6.0V
COM......................................................................-0.3V to +0.3V
Continuous Current Into M1, M2 ...........................................±3A
Continuous Power Dissipation (TA = +70°C)
Single-Layer Board (derate at 15.9mW/°C
above +70°C)...........................................................1270mW
Multilayer Board (derate at 24.4mW/°C
above +70°C)...........................................................1951mW
Operating Temperature Range............................ -40°C to +85°C
Junction Temperature....................................................... +150ºC
Storage Temperature Range..............................-65ºC to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Solder Temperature (reflow) ............................................+260°C
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
Junction-to-Case Thermal Resistance (θJC)
TDFN-EP (Single-Layer Board)...................................8.5°C/W
TDFN-EP (Multilayer Board)........................................8.5°C/W
Junction-to-Ambient Thermal Resistance (θJA)
TDFN-EP (Single-Layer Board)....................................63°C/W
TDFN-EP (Multilayer Board).........................................41°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = 4.5V to 36V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VDD = 12V, TA = +25°C) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP MAX
POWER SUPPLY
Supply Voltage
Supply Current
VDD
IDD
EN = low, M1/M2
not connected
fPWM/FWD =
50kHz
No switching
4.5
36
1
0.5
1.2
UNITS
V
mA
Shutdown Supply Current
Undervoltage Lockout
Threshold
ISHDN
VUVLO
EN = high, driver VDD = 12V
is in shutdown
VDD = 36V
VDD rising
3.7
10
μA
10
20
3.3
3.8
4.3
V
Undervoltage Lockout
Threshold Hysteresis
VUVLO_HYST
400
mV
www.maximintegrated.com
Maxim Integrated ââ 2
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