MAX14523A_11 Datasheet, PDF (2/11 Pages) Maxim Integrated Products – 250mA to 1.5A, Adjustable Current-Limit Switches

250mA to 1.5A, Adjustable
Current-Limit Switches
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
IN, ON, ON, FLAG, OUT, and SETI to GND .............-0.3V to +6V
Current into Any Pin (Except IN, OUT)................................20mA
Out Short Circuit to GND...................................Internally Limited
Continuous Power Dissipation (T_A = +70°C) for multilayer board:
TDFN (derate 24.4mW/°C above +70°C)...................1952mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θ_JA) ...........41°C/W
Junction-to-Case Thermal Resistance (θ_JC) ..................8°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V_IN = +1.7V to +5.5V, R_SETI = 94.2kΩ, C_IN = C_OUT = 1µF, and T_A = T_J = -40°C to +125°C, unless otherwise noted. Typical values
are at V_IN = +3.3V, T_A = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
SUPPLY OPERATION
Operating Voltage
Quiescent Current
Latchoff Current
V_IN
I_Q
I_LATCH
I_OUT = 0A, switch on, V_IN = 3.3V
V_IN = 3.3V, I_OUT = 0A , after an overcurrent
fault (MAX14523B)
Shutdown Forward Current
Shutdown Reverse Current
I_SHDN
I_RSHDN
V_ON = 0V, V_ON = V_IN, V_IN = 5.5V, V_OUT = 0V
V_ON = 0V, V_ON = V_IN, V_IN = 1.7V, V_OUT =
5.5V (current into OUT)
INTERNAL FET
Switch-On Resistance
Forward-Current Limit
(R_SETI +2.48k
) × I_LIM Product
R_ON
I_LIM
V_IN = 3.3V, I_OUT lower than I_LIM
R_SETI = 91.78k
, V_IN - V_OUT = 1V
R_SETI = 563.12k
, V_IN - V_OUT = 1V
I_LIM = 250mA to 1500mA,
V_IN - V_OUT = 1V
Reverse Blocking Current
V_OUT > V_IN + 140mV, after reverse-current-
limit shutdown
Reverse Blocking Threshold
V_OUT - V_IN
V_OUT - V_IN = 300mV, OUT falling until
switch turns on
FLAG Assertion Drop Voltage
Threshold
ON, ON INPUT
ON, ON Input Leakage
ON, ON Input Logic-High Voltage
ON, ON Input Logic-Low Voltage
V_FA
I_LEAK
V_IH
V_IL
Increase (V_IN - V_OUT) drop until FLAG
asserts, I_OUT limiting, V_IN = 3.3V
V_ON, V_ON = V_IN or V_GND
MIN
1.7
1350
225
127.2
40
-1
1.6
TYP
170
10
0.5
0.01
70
1500
250
141.4
95
350
MAX
5.5
300
20
7
0.6
130
1650
275
155.5
2
140
+1
0.4
UNITS
V
μA
μA
μA
μA
m

mA
kV
μA
mV
mV
μA
V
V
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