MAX13442E_11 Datasheet, PDF (2/18 Pages) Maxim Integrated Products – ±15kV ESD-Protected, ±80V Fault-Protected, Fail-Safe RS-485/J1708 Transceivers

±15kV ESD-Protected, ±80V Fault-Protected,
Fail-Safe RS-485/J1708 Transceivers
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
V_CC ........................................................................................+7V
RE, DE, DE, DI, TXD ...................................-0.3V to (V_CC + 0.3V)
A, B (Note 1) (MAX13442E/MAX13444E) ............................±80V
A, B (Note 1) (MAX13443E) .................................................±60V
RO ..............................................................-0.3V to (V_CC + 0.3V)
Short-Circuit Duration (RO, A, B) ...............................Continuous
Continuous Power Dissipation (T_A = +70°C)
SO (derate 7.6mW/°C above +70°C) ...........................606mW
Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: During normal operation, a termination resistor must be connected between A and B in order to guarantee overvoltage pro-
tection up to the absolute maximum rating of this device. When not in operation, these devices can withstand fault voltages
up to the maximum rating without a termination resistor and will not be damaged.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
SO
Junction-to-Ambient Thermal Resistance (θ_JA) .........132°C/W
Junction-to-Case Thermal Resistance (θ_JC) ................38°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS
(V_CC = +4.75V to +5.25V, T_A = T_MIN to T_MAX, unless otherwise noted. Typical values are at V_CC = +5V and T_A = +25°C.)
PARAMETER
DRIVER
Differential Driver Output
Change in Magnitude of
Differential Output Voltage
SYMBOL
CONDITIONS
V_OD
V_OD
Figure 1, R_L = 100

Figure 1, R_L = 54

Figure 1, R_L = 100
or 54
(Note 3)
MIN TYP MAX
2
V_CC
1.5
V_CC
0.2
Driver Common-Mode
Output Voltage
V_OC Figure 1, R_L = 100
or 54

V_CC / 2 3
Change in Magnitude of
Common-Mode Voltage
V_OC
Figure 1, R_L = 100
or 54
(Note 3)
(MAX13442E/MAX13443E)
0.2
DRIVER LOGIC
Driver-Input High Voltage
Driver-Input Low Voltage
Driver-Input Current
Driver Short-Circuit Output Current
(Note 4)
Driver Short-Circuit Foldback
Output Current
Driver-Limit Short-Circuit Foldback
Output Current
V_DIH
V_DIL
I_DIN
I_OSD
I_OSDF
I_OSDL
0V
V_OUT
+12V
-7V
V_OUT
V_CC
(V_CC - 1V)
V_OUT
+12V (Note 4)
-7V
V_OUT
+1V (Note 4)
V_OUT  +20V, R_L = 100
V_OUT
-15V, R_L = 100
2
-350
+25
+6
0.8
±2
+350
-25
-6
UNITS
V
V
V
V
V
V
μA
mA
mA
mA
2 _______________________________________________________________________________________