MAX3735 Datasheet, PDF (16/18 Pages) Maxim Integrated Products – 2.7Gbps, Low-Power SFP Laser Drivers

2.7Gbps, Low-Power SFP Laser Drivers
Bonding Coordinates
Table 5. MAX3735 Bondpad Locations
PAD
NAME
COORDINATES
X
Y
1*
BC_MON
47
47
2
PC_MON
47
229
3
V_CC
47
514
4
IN-
47
696
5
IN+
47
878
6
V_CC
47
1063
7
GND
242
1149
8
TX_DISABLE
452
1149
9
APCSET
636
1149
10
GND
819
1149
11
APCFILT2
1008
1149
12
APCFILT1
1193
1149
13
MD
1383
1149
14
GND
1567
1149
15
V_CC
16**
OUT-
1758
1758
1032
888
17**
OUT-
1758
742
18**
OUT+
1758
579
19**
OUT+
1758
433
20
V_CC
1758
289
21
BIAS
1758
93
22
GND
1578
-64
23
GND
1401
-64
24
MODSET
1205
-64
25
TX_FAULT
1016
-64
26
SHUTDOWN
818
-64
27
V_CC
623
-64
28
GND
435
-64
29
GND
245
-64
*Index pad. Orient the die with this pad in the lower-left corner.
**Bond out both pairs of OUT- and OUT+ to minimize series
inductance.
Pin Configuration
TOP VIEW
24 23 22 21 20 19
V_CC 1
IN+ 2
IN- 3
V_CC 4
PC_MON 5
BC_MON 6
MAX3735
MAX3735A
18 V_CC
17 OUT-
16 OUT+
15 OUT+
14 V_CC
13 BIAS
7 8 9 10 11 12
Thin QFN*
(4mm x 4mm)
*THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD GROUND FOR PROPER
THERMAL AND ELECTRICAL PERFORMANCE.
Chip Information
TRANSISTOR COUNT: 327
SUBSTRATE CONNECTED TO GND
DIE SIZE: 60 mils x 79 mils
PROCESS: SiGe Bipolar
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