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MAX9775 Datasheet, PDF (15/37 Pages) Maxim Integrated Products – 2 x 1.5W, Stereo Class D Audio Subsystem with DirectDrive Headphone Amplifier
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2 x 1.5W, Stereo Class D Audio Subsystem
with DirectDrive Headphone Amplifier
PIN
TQFN
UCSP
1
F1
2
E1
3
D2
4, 29
D1, F3
5
C1
6
C2
7
B1
8
B2
9
A1
10
A2
11
B3
12
A3
13
A4
14
B4
15
A5
16
A6
17
B5
18
B6
19
C5
20
C6
21
D6
22
D5
23
E6
24
E5
25
F6
26
F5
27
E4
28
F4
30
E3
31
F2
32
E2
EP
—
Pin Description—MAX9775
NAME
FUNCTION
PVDD
OUTL-
SCL
PGND
OUTL+
SDA
CL_L
CL_H
CPVDD
C1P
VBIAS
CPGND
C1N
INC1
CPVSS
HPL
VSS
HPR
INC2
OUTRx
VDD
INB2
CR_L
INB1
GND
CR_H
INA2
OUTR+
INA1
OUTR-
SHDN
EP
Class D Power Supply
Negative Left-Speaker Output
Serial Clock Input. Connect a 1kΩ pullup resistor from SCL to VDD.
Power Ground
Positive Left-Speaker Output
Serial Data Input. Connect a 1kΩ pullup resistor from SDA to VDD.
3D External Capacitor 3. Connect a 22nF capacitor to GND.
3D External Capacitor 4. Connect a 22nF capacitor to GND.
Charge-Pump Power Supply
Charge-Pump Flying Capacitor Positive Terminal
Common-Mode Bias
Charge-Pump GND
Charge-Pump Flying Capacitor Negative Terminal
Input C1. Left input or positive input (see Table 5a).
Charge-Pump Output. Connect to VSS.
Left Headphone Output
Headphone Amplifier Negative Power Supply. Connect to CPVSS.
Right Headphone Output
Input C2. Right input or negative input (see Table 5a).
Mono Receiver Output
Analog Power Supply
Input B2. Right input or negative input (see Table 5a).
3D External Capacitor 1. Connect a 22nF capacitor to GND.
Input B1. Left input or positive input (see Table 5a).
Analog Ground
3D External Capacitor 2. Connect a 22nF capacitor to GND.
Input A2. Right input or negative input (see Table 5a).
Positive Right Speaker Output
Input A1. Left input or positive input (see Table 5a).
Negative Right Speaker Output
Active-Low Hardware Shutdown
Exposed Pad. The external pad lowers the package’s thermal impedance by providing a
direct heat conduction path from the die to the PCB. The exposed pad is internally connected
to GND. Connect the exposed thermal pad to the GND plane.
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