DS1338_11 Datasheet, PDF (15/16 Pages) Maxim Integrated Products – I2C RTC with 56-Byte NV RAM

DS1338 I²C RTC with 56-Byte NV RAM
HANDLING, PCB LAYOUT, AND ASSEMBLY
The DS1338C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to
prevent damage to the crystal. Exposure to reflow is limited to 2 times maximum.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The RoHS and lead-free/RoHS packages may be reflowed using a reflow profile that complies with JEDEC J-STD-
020.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-
sensitive device (MSD) classifications.
PIN CONFIGURATIONS
TOP VIEW
X1
VCC
18
X2 _{2 7} SQW/OUT
VBAT
3
6
SCL
GND 4 5 SDA
SO, μSOP
TOP VIEW
SCL
SQW /OUT
Vcc
N.C.
N.C.
N.C.
N.C.
N.C.
DS1338C
SDA
GND
VBAT
N.C.
N.C.
N.C.
N.C.
N.C.
SO (300 mils)
CHIP INFORMATION
TRANSISTOR COUNT: 12,231
PROCESS: CMOS
THERMAL INFORMATION
PART
8 SO
8 μSOP
16 SO
THETA-J_A
(°C/W)
132
206.3
73
THETA-J_C
(°C/W)
38
42
23
PACKAGE INFORMATION
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages.
Note that a “+”, “#”, or “-“ in the package code indicates RoHS status only. Package drawings may show a different
suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
8 SO
8 µMAX
16 SO
PACKAGE CODE
S8+4
U8+1
W16#H2
OUTLINE NO.
21-0041
21-0036
21-0042
LAND PATTERN NO.
90-0096
90-0092
90-0107
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