DS1337_06 Datasheet, PDF (15/15 Pages) Maxim Integrated Products – I2C Serial Real-Time Clock

DS1337 I²C Serial Real-Time Clock
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
The DS1337C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS
TOP VIEW
X1
X2
INTA
GND
DS1337
DIP
V_CC
SQW/INTB
SCL
SDA
X1
X2
INTA
GND
DS1337
V_CC
SQW/INTB
SCL
SDA
SO, µSOP
SCL
SQW/INTB
V_CC
N.C.
N.C.
N.C.
N.C.
N.C.
DS1337C
SDA
GND
INTA
N.C.
N.C.
N.C.
N.C.
N.C.
SO (300 mils)
CHIP INFORMATION
TRANSISTOR COUNT: 10,950
PROCESS: CMOS
THERMAL INFORMATION
PACKAGE
8 DIP
8 SO
8 µSOP
16 SO
THETA-J_A
(°C/W)
110
170
229
73
THETA-J_C
(°C/W)
40
40
39
23
PACKAGE INFORMATION
For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo.
PACKAGE TYPE
8-pin PDIP
8-pin SO
8-pin µSOP
16-pin SO
DOCUMENT NUMBER
56-G5005-000
56-G2008-001
21-0036
56-G4009-001
15 of 15
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No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2006 Maxim Integrated Products
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