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MAX15041 Datasheet, PDF (14/16 Pages) Maxim Integrated Products – Low-Cost, 3A, 4.5V to 28V Input, 350kHz, PWM Step-Down DC-DC Regulator with Internal Switches
Low-Cost, 3A, 4.5V to 28V Input, 350kHz, PWM
Step-Down DC-DC Regulator with Internal Switches
For RLOAD much greater than ESR, the equation can be
further simplified as follows:
RC
=
VOUT
VFB
×
2π × fCO × COUT
gMV × GMOD
where VFB is equal to 0.606V.
3) Select CC. CC is determined by selecting the
desired first system zero, fZ1, based on the desired
phase margin. Typically, setting fZ1 below 1/5th of
fCO provides sufficient phase margin.
fZ1
=
2π
1
× CCRC
≤
fCO
5
therefore:
5
CC ≥ 2π × fCO × RC
4) If the ESR output zero is located at less than one-half
the switching frequency use the (optional) sec-
ondary compensation capacitor, CCC, to cancel it,
as follows:
1
2π × CCCRC
=
fP3
=
fZ2
=
2π
1
× COUTESR
therefore:
CCC
=
COUT ×
RC
ESR
If the ESR zero exceeds 1/2 the switching frequency,
use the following equation:
fP3
=
1
2π × CCCRC
=
fSW
2
therefore:
CCC
=
2π
×
2
fSW
× RC
The downside of CCC is that it detracts from the overall
system phase margin. Care should be taken to guarantee
this third-pole placement is well beyond the desired
crossover frequency, minimizing its interaction with the
system loop response at crossover. If CCC is smaller than
10pF, it can be neglected in these calculations.
Setting the Soft-Start Time
The soft-start feature ramps up the output voltage slow-
ly, reducing input inrush current during startup. Size the
CSS capacitor to achieve the desired soft-start time tSS
using:
CSS
=
ISS × tSS
VFB
ISS, the soft-start current, is 5µA (typ) and VFB, the out-
put feedback voltage threshold, is 0.606V (typ). When
using large COUT capacitance values, the high-side
current limit may trigger during the soft-start period. To
ensure the correct soft-start time, tSS, choose CSS large
enough to satisfy:
CSS
>>
COUT
×
VOUT × ISS
(IHSCL _ MIN − IOUT ) ×
VFB
IHSCL_MIN is the minimum high-side switch, current-
limit value.
Power Dissipation
The MAX15041 is available in a thermally enhanced
TQFN package and can dissipate up to 1.666W at TA =
+70°C. The exposed pad should be connected to
SGND externally, preferably soldered to a large ground
plane to maximize thermal performance. When the die
temperature exceeds +155°C, The thermal-shutdown
protection is activated (see the Thermal-Shutdown
Protection section).
Layout Procedure
Careful PCB layout is critical to achieve clean and sta-
ble operation. It is highly recommended to duplicate
the MAX15041 evaluation kit layout for optimum perfor-
mance. If deviation is necessary, follow these guide-
lines for good PCB layout:
1) Connect input and output capacitors to the power
ground plane; connect all other capacitors to the
signal ground plane.
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