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MAX1649 Datasheet, PDF (11/12 Pages) Maxim Integrated Products – 5V/3.3V or Adjustable, High-Efficiency, Low-Dropout, Step-Down DC-DC Controllers
5V/3.3V or Adjustable, High-Efficiency,
Low-Dropout, Step-Down DC-DC Controllers
Table 2. Component Suppliers
COMPANY
AVX
USA
Coiltronics
CoilCraft
Dale
International
Rectifier
IRC
USA
USA
USA
USA
USA
Motorola
USA
Nichicon
Nihon
Sanyo
USA
Japan
USA
Japan
USA
Japan
Siliconix
USA
Sprague
Sumida
United
Chemi-Con
USA
USA
Japan
USA
PHONE
(207) 282-5111
or
(800) 282-4975
(407) 241-7876
(708) 639-6400
(402) 564-3131
(310) 322-3331
(512) 992-7900
(602) 244-3576
or
(602) 244-5303
(708) 843-7500
81-7-5231-8461
(805) 867-2555
81-3-3494-7411
(619) 661-6835
81-7-2070-6306
(408) 988-8000
or
(800) 554-5565
(603) 224-1961
(708) 956-0666
81-3-3607-5111
(714) 255-9500
FAX
(207) 283-1941
(407) 241-9339
(708) 639-1469
(402) 563-1841
(310) 322-3332
(512) 992-3377
(602) 244-4015
(708) 843-2798
81-7-5256-4158
(805) 867-2556
81-3-3494-7414
(619) 661-1055
81-7-2070-1174
(408) 970-3950
(603) 224-1430
(708) 956-0702
81-3-3607-5144
(714) 255-9400
Input Bypass Capacitor
The input bypass capacitor reduces peak currents
drawn from the voltage source, and also reduces the
amount of noise at the voltage source caused by the
switching action of the MAX1649/MAX1651. The input
voltage source impedance determines the size of the
capacitor required at the V+ input. As with the output fil-
ter capacitor, a low-ESR capacitor is recommended.
Bypass the IC separately with a 0.1µF ceramic capac-
itor placed close to the V+ and GND pins.
Reference Capacitor
Bypass REF with a 0.1µF or larger capacitor.
Layout Considerations
Proper PC board layout is essential because of high
current levels and fast switching waveforms that radi-
ate noise. Minimize ground noise by connecting the
anode of the rectifier, the input bypass capacitor
ground lead, and the output filter capacitor ground
lead to a single point (“star” ground configuration). A
ground plane is recommended. Also minimize lead
lengths to reduce stray capacitance, trace resistance,
and radiated noise. In particular, the traces connected
to FB (if an external resistor divider is used) and EXT
must be short. Place the 0.1µF ceramic bypass capac-
itor as close as possible to the V+ and GND pins.
MAX1649/MAX1651 vs. MAX649/MAX651
The MAX1649 and MAX1651 are pin compatible with
the MAX649 and MAX651, but have been optimized for
improved dropout performance and efficiency—partic-
ularly with low input voltages. The MAX1649/MAX1651
feature increased maximum switch duty cycle (96.5%)
and reduced current-limit sense voltage (110mV).
Their predecessors, the MAX649/MAX651, use a high-
er two-step (210mV/110mV) current-limit sense voltage
to provide tighter current-sense accuracy and reduced
inductor peak current at light loads.
___________________Chip Topography
OUT
GND
FB
SHDN
EXT
0.106"
(2.692mm)
CS
REF
V+
0.081"
(2.057mm)
TRANSISTOR COUNT: 428
SUBSTRATE CONNECTED TO V+
______________________________________________________________________________________ 11