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MAX882_09 Datasheet, PDF (10/17 Pages) Maxim Integrated Products – 5V/3.3V or Adjustable, Low-Dropout, Low IQ, 200mA Linear Regulators
5V/3.3V or Adjustable, Low-Dropout,
Low IQ, 200mA Linear Regulators
1.6
MAX883, VOUT = 5V
1.5 8-PIN SO PACKAGE
77.4cm2,
1.4 SINGLE-SIDED BOARD
1oz COPPER
1.3
GLASS EPOXY,
TJ = +125°C,
TA = +25°C, STILL AIR
1.2
1.1
1.0
0.9
0.1cm2
0.0155in2
1cm2
0.155in2
10cm2
1.55in2
COPPER GROUND PAD AREA
100cm2
15.5in2
250
MAXIMUM POWER
DISSIPATION LIMIT
MAXIMUM CURRENT
200
HIGH-
150
POWER
SOIC
PLASTIC DIP
100
CERAMIC DIP
50
OPERATING
REGION AT
TA = +25°C
TJ = +125°C
0
2 3 4 5 6 7 8 9 10 11 12 13
SUPPLY VOLTAGE (V)
Figure 4. Typical Maximum Power Dissipation vs. Ground Pad
Area
Figure 5a. Safe Operating Regions: MAX882/MAX884 Maximum
Output Current vs. Supply Voltage
The GND pins of the MAX882/MAX883/MAX884 SOIC
package perform the dual function of providing an elect-
rical connection to ground and channeling heat away. Con-
nect all GND pins to ground using a large pad or ground
plane. Where this is impossible, place a copper plane on an
adjacent layer. For a given power dissipation, the pad
should exceed the associated dimensions in Figure 4.
Figure 4 assumes the IC is in an 8-pin small-outline pack-
age that has a maximum junction temperature of +125°C
and is soldered directly to the pad; it also has a +25°C
ambient air temperature and no other heat sources. Use
larger pad sizes for other packages, lower junction tem-
peratures, higher ambient temperatures, or conditions
where the IC is not soldered directly to the heat-sinking
ground pad. When operating C- and E-grade parts up to a
TJ of +125°C, expect performance similar to M-grade
specifications. For TJ between +125°C and +150°C, the
output voltage may drift more.
The MAX882/MAX883/MAX884 can regulate currents up
to 250mA and operate with input voltages up to 11.5V, but
not simultaneously. High output currents can only be sus-
tained when input-output differential voltages are small, as
shown in Figure 5. Maximum power dissipation depends
on packaging, temperature, and air flow. The maximum
output current is as follows:
IOUT(MAX)
=
P(TJ − TA )
(VIN − VOUT)100°C
where P is derived from Figure 4.
250
MAXIMUM POWER
DISSIPATION LIMIT
MAXIMUM CURRENT
200
HIGH-
POWER
150
SOIC
PLASTIC DIP
100
CERAMIC DIP
OPERATING
50
REGION AT
TA = +25°C
TJ = +125°C
0
4 5 6 7 8 9 10 11 12 13
SUPPLY VOLTAGE (V)
Figure 5b. Safe Operating Regions: MAX883 Maximum Output
Current vs. Supply Voltage
10 ______________________________________________________________________________________