MAX3397E Datasheet, PDF (10/13 Pages) Maxim Integrated Products – Dual Bidirectional Low-Level Translator in μDFN

Dual Bidirectional Low-Level
Translator in µDFN
to design equipment that meets Level 4 of IEC 61000-
4-2 without the need for additional ESD-protection com-
ponents.
The major difference between tests done using the
Human Body Model and IEC 61000-4-2 is higher peak
current in IEC 61000-4-2 because series resistance is
lower in the IEC 61000-4-2 model. Hence, the ESD
withstand voltage measured to IEC 61000-4-2 is gener-
ally lower than that measured using the Human Body
Model. Figure 3a shows the IEC 61000-4-2 model, and
Figure 3b shows the current waveform for the ±8kV,
IEC 61000-4-2, Level 4, ESD contact-discharge test.
The Air-Gap test involves approaching the device with a
charged probe. The contact-discharge method connects
the probe to the device before the probe is energized.
R_C 50MΩ to 100MΩ R_D 330Ω
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
HIGH-
VOLTAGE
DC
SOURCE
Cs
150pF
STORAGE
CAPACITOR
DEVICE
UNDER
TEST
Figure 3a. IEC 61000-4-2 ESD Test Model
I
100%
90%
Machine Model
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. Of course, all pins require this protec-
tion during manufacturing, not just inputs and outputs.
Therefore, after PCB assembly, the Machine Model is
less relevant to I/O ports.
Applications Information
Power-Supply Decoupling
To reduce ripple and the chance of transmitting incorrect
data, bypass V_L and V_CC to ground with a 0.1µF capaci-
tor (see the Typical Application Circuit). To ensure full
±15kV ESD protection, bypass V_CC to ground with a 1µF
capacitor. Place all capacitors as close as possible to
the power-supply inputs.
I²C Level Translation
The MAX3397E level-shifts the data present on the I/O
lines between +1.2V and +5.5V, making them ideal for
level translation between a low-voltage ASIC and an
I²C device. A typical application involves interfacing a
low-voltage microprocessor to a 3V or 5V D/A convert-
er, such as the MAX517.
Push-Pull vs. Open-Drain Driving
The MAX3397E can be driven in a push-pull configura-
tion and include internal 10kΩ resistors that pull up I/O
V_{L_} and I/O V_{CC_} to their respective power supplies,
allowing operation of the I/O lines with open-drain
devices. See the Timing Characteristics table for maxi-
mum data rates when using open-drain drivers.
PROCESS: BiCMOS
Chip Information
10%
tr = 0.7ns to 1ns
t
30ns
60ns
Figure 3b. IEC 61000-4-2 ESD Generator Current Waveform
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