MAX16922_11 Datasheet, PDF (10/17 Pages) Maxim Integrated Products – 2.2MHz, Dual, Step-Down DC-DC Converters, Dual LDOs, and RESET

2.2MHz, Dual, Step-Down DC-DC
Converters, Dual LDOs, and RESET
PIN
TQFN
TSSOP
8
10
9
11
10
12
11
13
12
14
13
15
14
16
15
17
16
18
17
19
18
20
19
1
20
2
—
—
Pin Description (continued)
NAME
FUNCTION
OUTS2
PGND2
LX2
PV2
PV3
OUT3
GND2
OUT4
PV4
LSUP
RESET
GND1
EN
EP
OUT2 Voltage Sense Input. Connect OUTS2 directly to the OUT2 output voltage and
bypass to PGND2 with a minimum total capacitance of 10µF. The total capacitance can
include input bypass capacitors cascaded from OUT2, discharged by a 70Ω resistance
between OUTS2 and PGND2 when disabled.
Power Ground for BUCK 2. Connect PGND2 and GND_ together near the device.
Inductor Connection for OUT2. Connect a 2.2µH inductor between LX2 and OUT2 as shown
in the Functional Diagram.
OUT2 Supply Input. Connect a 4.7µF or larger ceramic capacitor from PV2 to ground.
Linear-Regulator Power Input for OUT3. Bypass PV3 to GND with a minimum 2.2µF ceramic
capacitor.
Linear-Regulator 1 Output. Bypass OUT3 to GND with a minimum 2.2µF ceramic capacitor
internally discharged by a 1kΩ resistance when disabled.
Ground. Connect GND, GND1, GND2, and GND3 together.
Linear-Regulator 2 Output. Bypass OUT4 to GND with a minimum 2.2µF ceramic capacitor.
Internally discharged by a 1kΩ resistance when disabled.
Linear-Regulator Power Input for OUT4. Bypass PV4 to GND with a minimum 2.2µF ceramic
capacitor.
5V Logic Supply to Provide Power to Internal Circuitry. Bypass LSUP to GND1 with a 1µF
ceramic capacitor.
Open-Drain Reset Output for the Input Monitoring OUT1 and OUT2. External pullup
required.
Ground. Connect GND, GND1, GND2, and GND3 together.
Active-High Enable Input. Connect EN to PV1 or a logic-high voltage to turn on all
regulators. Pull EN input low to place the regulators in shutdown.
Exposed Pad. Connect the exposed pad to ground. Connecting the exposed pad to ground
does not remove the requirement for proper ground connections to PGND2 and GND_. The
exposed pad is attached with epoxy to the substrate of the die, making it an excellent path
to remove heat from the device.
10 ______________________________________________________________________________________