MAX6604 Datasheet, PDF (1/16 Pages) Maxim Integrated Products – Precision Temperature Monitor for DDR Memory Modules

19-3837; Rev 0; 10/05
Precision Temperature Monitor for
DDR Memory Modules
General Description
The MAX6604 high-precision temperature sensor is
designed for thermal monitoring functions in DDR memo-
ry modules. The device is readable and programmable
through the 2-wire SMBus™/I²C-compatible interface.
Three address inputs set the bus address for the temper-
ature sensor to provide up to eight devices on one bus.
The internal thermal sensor continuously monitors the
temperature and updates the temperature data eight
times per second. The master can read the tempera-
ture data at any time. Since the thermal sensor is locat-
ed on the memory module, temperature data recorded
accurately represents the temperature of the compo-
nents on the module. Consequently, the MAX6604 pro-
vides a much more accurate measurement of module
temperature than techniques involving temperature
sensors on the motherboard. In addition, the device
responds more quickly to temperature changes on the
module than a motherboard sensor.
The MAX6604 also features an interrupt-output indica-
tor for temperature-threshold monitoring. The threshold
levels are programmable through the digital interface.
The MAX6604 operates from -20°C to +125°C, and is
available in JEDEC-standard 8-pin TSSOP and TDFN
(MO-229-WCED-2) packages.
Applications
Memory Modules
Desktop Computers
Notebook Computers
Workstations
Networking Equipment
Features
♦ JEDEC Compliant
♦ ±1°C Temperature-Monitoring Accuracy
♦ Overtemperature Interrupt with Programmable
Threshold
♦ +2.7V to +3.6V Operating Voltage Range
♦ SMBus/I²C-Compatible Interface
♦ 300µA Typical Operating Current
♦ 3µA Typical Shutdown Current
♦ -20°C to +125°C Operating Temperature Range
♦ 8-Pin TSSOP and TDFN (MO-229-WCED-2)
Packages
Ordering Information
PART
TEMP RANGE PIN-PACKAGE
PKG
CODE
MAX6604ATA
-20°C to +125°C
8 TDFN-EP**
(MO229-WCED-2)
T823-1
MAX6604AHA -20°C to +125°C 8 TSSOP
**EP = Exposed paddle.
H8-1
TOP VIEW
Pin Configurations
VCC EVENT SCL SDA
8765
MAX6604
Typical Application Circuit appears at end of data sheet.
1 234
A0 A1 A2 GND
TDFN-EP**
SMBus is a trademark of Intel Corporation.
A0 1
A1 2
A2 3
MAX6604
8 VCC
7 EVENT
6 SCL
GND 4
5 SDA
TSSOP
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