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MAX4721 Datasheet, PDF (1/14 Pages) Maxim Integrated Products – 4.5 Dual SPST Analog Switches in UCSP
19-2632; Rev 0; 10/02
4.5Ω Dual SPST Analog Switches in UCSP
General Description
The MAX4721/MAX4722/MAX4723 low-voltage, low on-
resistance (RON), dual single-pole/single throw (SPST)
analog switches operate from a single +1.8V to +5.5V
supply. These devices are designed for USB 1.1 and
audio switching applications.
The MAX4721/MAX4722/MAX4723 feature 4.5Ω RON
(max) with 1.2Ω flatness and 0.3Ω matching between
channels. These new switches feature guaranteed
operation from +1.8V to +5.5V and are fully specified at
3V and 5V. These switches offer break-before-make
switching (1ns) with tON <80ns and tOFF <40ns at
+2.7V. The digital logic inputs are +1.8V logic compati-
ble with a +2.7V to +3.6V supply.
These switches are packaged in a chip-scale package
(UCSP™), significantly reducing the required PC board
area. The chip occupies only a 1.52mm ✕ 1.52mm area
and has a 3 ✕ 3 bump array with a bump pitch of
0.5mm. These switches are also available in an 8-pin
µMAX package.
Features
o USB 1.1 Signal Switching
o <2ns Differential Skew
o -3dB Bandwidth: >300MHz
o Low 15pF On-Channel Capacitance
o Low RON (max) Switches
4.5Ω (max) (+3V Supply)
3Ω (max) (+5V Supply)
o 0.3Ω (max) RON Match (+3V Supply)
o 1.2Ω (max) RON Flatness (+3V Supply)
o <0.5nA Leakage Current at TA = +25°C
o High Off-Isolation: -55dB (10MHz)
o Low Crosstalk: -80dB (10MHz)
o Low Distortion: 0.03%
o +1.8V CMOS-Logic Compatible
o Single-Supply Operation from +1.8V to +5.5V
o Rail-to-Rail® Signal Handling
Applications
Ordering Information
Battery-Operated Equipment
Audio/Video-Signal Routing
Low-Voltage Data-Acquisition Systems
Sample-and-Hold Circuits
Communications Circuits
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
UCSP is a trademark of Maxim Integrated Products, Inc.
PART
TEMP RANGE
PIN/BUMP-
PACKAGE
TOP
MARK
MAX4721EUA
-40°C to +85°C 8 µMAX
—
MAX4721EBL-T* -40°C to +85°C 9 UCSP-9
ABP
MAX4722EUA
-40°C to +85°C 8 µMAX
—
MAX4722EBL-T* -40°C to +85°C 9 UCSP-9
ABQ
MAX4723EUA
-40°C to +85°C 8 µMAX
—
MAX4723EBL-T* -40°C to +85°C 9 UCSP-9
ABR
Note: UCSP package requires special solder temperature pro-
file described in the Absolute Maximum Ratings section.
*UCSP reliability is integrally linked to the user’s assembly meth-
ods, circuit board material, and environment. See the UCSP reli-
ability notice in the UCSP Reliability section of this data sheet for
more information.
Pin Configurations/Functional Diagrams/Truth Tables
TOP VIEW
(BUMP SIDE DOWN)
A
MAX4721
1
2
3
IN2 GND NO2
B
COM1
COM2
C
NO1 V+ IN1
UCSP
MAX4722
1
2
3
A
IN2 GND NC2
B
COM1
COM2
C
NC1 V+ IN1
UCSP
MAX4723
1
2
3
A
IN2 GND NC2
B
COM1
COM2
C
NO1 V+ IN1
UCSP
IN_ NO_ NC_
LOW OFF ON
HIGH ON OFF
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