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MAX2383 Datasheet, PDF (1/8 Pages) Maxim Integrated Products – W-CDMA Upconverter and PA Driver with Power Control
19-2108; Rev 1; 8/03
EVAALVUAAILTAIOBNLEKIT
W-CDMA Upconverter and PA Driver
with Power Control
General Description
The MAX2383 upconverter and PA driver IC
is designed for emerging ARIB (Japan) and
ETSI-UMTS (Europe) W-CDMA applications. The IC
includes an upconversion mixer with variable gain con-
trol, an LO buffer, and a variable-gain PA driver for out-
put power control.
The MAX2383 is designed to support the IMT-2000
frequency band. It includes a differential IF input port,
an LO input port, and PA driver input/output ports. The
upconverter mixer incorporates an AGC with over 30dB
of gain control. The IC provides automatic throttle-back
of PA driver and mixer current as output power is
reduced. The main signal path and the LO buffer can
be shutdown independently. The on-chip LO buffer can
be kept ON while the main transmitter path is being
turned on and off to minimize VCO pulling during TX
gated-transmission.
The MAX2383 is specified for +2.7V to +3.0V single
supply and is housed in an ultra-miniature 3 x 4
UCSP™ package for optimum cost- and space-reduc-
tion and for best RF performance. The IC is targeted for
the 2270MHz to 2580MHz LO frequency range. It is
fabricated using an advanced high-frequency bipolar
process. The mixer and PA driver linearity have been
optimized to provide excellent RF performance in the
1920MHz to 1980MHz band, while drawing minimal
current. The mixer’s performance is optimized for a
-10dBm ±3dB LO drive at the LO buffer input port. The
LO port can be configured to be driven either single-
ended or differentially.
The MAX2383 achieves excellent noise and image sup-
pression without the use of an interstage TX SAW band-
pass filter, thereby saving valuable board space, cost,
and supply current.
For LNA and downconverter mixer companion ICs, see
the MAX2387/MAX2388/MAX2389 data sheet.
Applications
Japanese 3G Cellular Phones (ARIB)
European 3G Cellular Phones (UMTS)
Chinese 3G Cellular Phones (TD-SCDMA)
PCS Phones
Pin Configuration appears at end of data sheet.
Typical Operating Circuit appears at end of data sheet.
Features
o +6dBm Output Power with -46dBc ACPR
o Ultra-Miniature UCSP Package
o Upconverter Gain-Control Range: 35dB
o Automatic Dynamic Current Control
o 12mA Quiescent Supply Current
o On-Chip LO Buffer with Disable
o Low Out-of-Band Noise Power in RX Band:
≤ -144dBm/Hz at +6dBm POUT
o No Interstage TX SAW Bandpass Filter Required
PART
MAX2383EBC-T
Ordering Information
TEMP RANGE
-40°C to +85°C
PIN-PACKAGE
3 x 4 UCSP
ACTUAL SIZE
UCSP
2mm ✕ 1.5mm
TOP VIEW
LO+ /
LO_EN
A1
LO-/ B1
SHDN
C1
IFIN-
Block Diagram
VCC
DROUT
A2
A3
MAX2383
GC B3
GND
A4
PA
DRVR
B4
DRIN
C2
C3
C4
IFIN+
RFOUT
GND
UCSP is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.