MAX2240 Datasheet, PDF (1/10 Pages) Maxim Integrated Products – 2.5GHz, +20dBm Power Amplifier IC in UCSP Package

19-1624; Rev 2; 2/03
EVAALVUAAILTAIOBNLEKIT
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
General Description
Features
The MAX2240 single-supply, low-voltage power amplifi-
er (PA) IC is designed specifically for applications in
the 2.4GHz to 2.5GHz frequency band. The PA is com-
pliant with Bluetooth, HomeRF, and 802.11 standards,
as well as other FSK modulation systems. The PA pro-
vides a nominal +20dBm (100mW) output power in the
highest power mode.
The PA includes a digital power control circuit to greatly
simplify control of the output power. Four digitally con-
trolled output power levels are provided: from +3dBm
to +20dBm. A digital input controls the active or shut-
down operating modes of the PA. In the shutdown
mode, the current reduces to 0.5µA.
o 2.4GHz to 2.5GHz Frequency Range
o High +20dBm Output Power
o 2-Bit Digital Power Control: Four Output Levels
o Integrated Input Match to 50Ω
o Low 105mA Operating Current
o 0.5µA Low-Power Shutdown Mode Current
o +2.7V to +5V Single-Supply Operation
o Miniature Chip-Scale Package (1.56mm x 1.56mm)
The IC integrates the RF input and interstage matching
to simplify application of the IC. Temperature and sup-
ply-independent biasing are also included to provide
stable performance under all operating conditions.
The IC operates from a +2.7V to +5V single-supply volt-
age. No negative bias voltage is required. Current con-
sumption is a modest 105mA at the highest power
level.
The part is packaged in the UCSP™ package signifi-
cantly reducing the required PC board area. The chip
occupies only a 1.56mm x 1.56mm area. The 3 x 3
array of solder bumps are spaced with a 0.5mm bump
pitch.
Ordering Information
PART
MAX2240EBL
TEMP RANGE
-40°C to +85°C
PIN-PACKAGE
9 UCSP*
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.
________________________Applications Pin Configuration appears at end of data sheet.
Bluetooth
HomeRF
802.11 FHSS WLAN
UCSP is a trademark of Maxim Integrated Products, Inc.
2.4GHz ISM Proprietary Radios
Typical Application Circuit/Functional Diagram
D0
D1
SHDN
RFIN
V_CC
220 pF
BIAS
BIAS &
POWER
CONTROL
MATCH
*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE
(SEE APPLICATIONS SECTION).
V_CC
V_CC
18pF
1.2nH* (BOARD TRACE)
V_CC
22nH
GND1
GND2
75Ω
θ = 26°
RFOUT
RFOUT
10pF
65Ω
θ = 41°
________________________________________________________________ Maxim Integrated Products 1
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