MT0350-WR-A Datasheet, PDF (5/7 Pages) Marktech Corporate – 3.2 x 2.8mm SMD TYPE

MT0350-WR-A
3.2 x 2.8mm SMD TYPE
PRECAUTION IN USE
Storage
Recommended storage environment
Temperature: 5 ^oC ~ 30^oC (41^oF ~ 86^oF)
Humidity:
60% RH Max.
Use within 7 days after opening of sealed vapor/ESD barrier bags.
If the mois ture absorbent mater ial (s ilica ge l) has faded a way or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60Ô5Ċ for 24 hours.
Fold the opened bag firmly and keep in dry environment.
Soldering
Reflow So ldering
Pre-heat
Lead Solder Lead – free Solder
120~150Ċ 180~200
Ċ
Pre-heat time
120sec. Max.
Peak temperature 240Ċ Max.
120sec. Max.
260Ċ Max .
Soldering time
10sec. Max.
10sec. Max.
Condition
refer to
refer to
T
emperature-
Temperature-
profile 1
profile 2
*After reflow soldering rapid cooling should be avoided.
Hand Soldering
Temperature
Soldering time
350Ċ Max .
3sec. Max.
(one time only)
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
Ö1 : Lead Solder×
Ö2 : Lead-free Solder×
2.5~5°C/sec.
Pre-heating
120~150° C
120sec. Max.
2.5~5°C/sec.
240°C Max.
10sec. Max.
60sec. Max.
1~5°C/sec.
Pre-heating
180~200°C
120sec. Max.
1~5°C/sec.
260°C Max.
10sec. Max.
60sec. Max.
[ Recommended soldering pad design ]
Use the following conditions shown in the figure.
2.2
(UNIT:mm)
VER.: 01 Date : 2009/10/ 09 Page: 4/